MT9HTF6472AY-40EB3 Micron Technology Inc, MT9HTF6472AY-40EB3 Datasheet - Page 3

• Manufacturer Part Number: MT9HTF6472AY-40EB3
• Description: MODULE SDRAM DDR2 512MB 240DIMM
• Manufacturer: Micron Technology Inc

Specifications of MT9HTF6472AY-40EB3

• Memory Type: DDR2 SDRAM
• Memory Size: 512MB
• Speed: 400MT/s
• Package / Case: 240-DIMM
• Main Category: DRAM Module
• Sub-category: DDR2 SDRAM
• Module Type: 240RDIMM
• Device Core Size: 72b
• Organization: 64Mx72
• Total Density: 512MByte
• Chip Density: 512Mb
• Access Time (max): 60ps
• Maximum Clock Rate: 400MHz
• Operating Supply Voltage (typ): 1.8V
• Operating Current: 1.035A
• Number Of Elements: 9
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Operating Temp Range: 0C to 85C
• Operating Temperature Classification: Commercial
• Pin Count: 240
• Mounting: Socket
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Table 5: Part Numbers and Timing Parameters – 1GB
Base device: MT47H128M8,
PDF: 09005aef80e8ad4d
htf9c32_64_128x72ay – Rev. F 3/10 EN
Part Number
MT9HTF12872A(I)Y-80E__
MT9HTF12872A(I)Y-800__
MT9HTF12872A(I)Y-667__
MT9HTF12872A(I)Y-53E__
MT9HTF12872A(I)Y-40E__
Notes:
1. The data sheet for the base device can be found on Micron’s Web site.
2. All part numbers end with a two-place code (not shown) that designates component and PCB revisions.
Consult factory for current revision codes. Example: MT9HTF6472AY-667C2.
2
1
1Gb DDR2 SDRAM
Module
Density
1GB
1GB
1GB
1GB
1GB
256MB, 512MB, 1GB (x72, SR, ECC) 240-Pin DDR2 UDIMM
Configuration
128 Meg x 72
128 Meg x 72
128 Meg x 72
128 Meg x 72
128 Meg x 72
3
Bandwidth
Module
6.4 GB/s
6.4 GB/s
5.3 GB/s
4.3 GB/s
3.2 GB/s
Micron Technology, Inc. reserves the right to change products or specifications without notice.
Memory Clock/
3.75ns/533 MT/s
2.5ns/800 MT/s
2.5ns/800 MT/s
3.0ns/667 MT/s
5.0ns/400 MT/s
Data Rate
© 2003 Micron Technology, Inc. All rights reserved.
(CL-
Clock Cycles
t
Features
5-5-5
6-6-6
5-5-5
4-4-4
3-3-3
RCD-
t
RP)