MT9HTF3272Y-53EB2 Micron Technology Inc, MT9HTF3272Y-53EB2 Datasheet - Page 8

• Manufacturer Part Number: MT9HTF3272Y-53EB2
• Description: MODULE DDR2 256MB 240DIMM
• Manufacturer: Micron Technology Inc

Specifications of MT9HTF3272Y-53EB2

• Memory Type: DDR2 SDRAM
• Memory Size: 256MB
• Speed: 533MT/s
• Package / Case: 240-DIMM
• Main Category: DRAM Module
• Sub-category: DDR2 SDRAM
• Module Type: 240RDIMM
• Device Core Size: 72b
• Organization: 32Mx72
• Total Density: 256MByte
• Chip Density: 256Mb
• Access Time (max): 500ps
• Maximum Clock Rate: 533MHz
• Operating Supply Voltage (typ): 1.8V
• Operating Current: 1.44A
• Number Of Elements: 9
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Operating Temp Range: 0C to 55C
• Operating Temperature Classification: Commercial
• Pin Count: 244
• Mounting: Socket
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Electrical Specifications
Table 8:
Capacitance
PDF: 09005aef817ab1fc/Source: 09005aef817ab1dd
HTF9C32_64_128x72K.fm - Rev. C 9/06 EN
V
Symbol
IN
V
V
T
T
V
T
I
DD
, V
CASE
V
DD
I
OPR
STG
DD
OZ
I
REF
I
OUT
Q
L
Absolute Maximum DC Ratings
Parameter
V
V
V
Voltage on any pin relative to V
Storage temperature
DDR2 SDRAM device operating temperature
Operating temperature
Input leakage current; Any input 0V ≤ V
V
under test = 0V)
Output leakage current; 0V ≤ V
and ODT are disabled
V
REF
REF
DD
DD
DD
Q supply voltage relative to V
L supply voltage relative to Vss
supply voltage relative to V
input 0V ≤ V
leakage current; V
Stresses greater than those listed in Table 8 may cause permanent damage to the device.
This is a stress rating only, and functional operation of the device at these or any other
conditions above those indicated in the operational sections of this specification is not
implied. Exposure to absolute maximum rating conditions for extended periods may
affect reliability.
At DDR2 data rates, Micron encourages designers to simulate the performance of the
module to achieve optimum values. When inductance and delay parameters associated
with trace lengths are used in simulations, they are significantly more accurate and real-
istic than a gross estimation of module capacitance. Simulations can then render a
considerably more accurate result. JEDEC modules are now designed by using simula-
tions to close timing budgets.
256MB, 512MB, 1GB: (x72, SR) 244-Pin DDR2 Registered MiniDIMM
IN
≤0.95V; (All other pins not
REF
= Valid V
OUT
SS
SS
SS
≤ V
REF
DD
level
IN
Q; DQs
≤ V
DD
8
;
Command/Address,
RAS#, CAS#, WE# S#,
CKE, ODT, DM
CK, CK#
DQ, DQS, DQS#
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Electrical Specifications
Min
–1.0
–0.5
–0.5
–0.5
–55
–10
–18
–5
–5
©2005 Micron Technology, Inc. All rights reserved.
0
0
+100
Max
+2.3
+2.3
+2.3
+2.3
+85
+55
+10
+18
+5
+5
Units
µA
µA
µA
°C
°C
°C
V
V
V
V