MT16LSDT3264AG-13EG3 Micron Technology Inc, MT16LSDT3264AG-13EG3 Datasheet - Page 21
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MT16LSDT3264AG-13EG3
Manufacturer Part Number
MT16LSDT3264AG-13EG3
Description
MODULE SDRAM 256MB 168-DIMM
Manufacturer
Micron Technology Inc
Datasheet
1.MT16LSDT3264AG-133G3.pdf
(26 pages)
Specifications of MT16LSDT3264AG-13EG3
Memory Type
SDRAM
Memory Size
256MB
Speed
133MHz
Package / Case
168-DIMM
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Table 20: Serial Presence-Detect EEPROM DC Operating Conditions
All voltages referenced to V
Table 21: Serial Presence-Detect EEPROM AC Operating Conditions
All voltages referenced to V
NOTE:
09005aef80bccbe7
SD8_16C16_32x64AG.fm - Rev. E 12/05 EN
1. To avoid spurious START and STOP conditions, a minimum delay is placed between SCL = 1 and the falling or rising
2. This parameter is sampled.
3. For a reSTART condition, or following a WRITE cycle.
4. The SPD EEPROM WRITE cycle time (
PARAMETER/CONDITION
PARAMETER/CONDITION
SUPPLY VOLTAGE
INPUT HIGH VOLTAGE: Logic 1; All inputs
INPUT LOW VOLTAGE: Logic 0; All inputs
OUTPUT LOW VOLTAGE: I
INPUT LEAKAGE CURRENT: V
OUTPUT LEAKAGE CURRENT: V
STANDBY CURRENT: SCL = SDA = V
POWER SUPPLY CURRENT: SCL clock frequency = 100 KHz
SCL LOW to SDA data-out valid
Time the bus must be free before a new transition can start
Data-out hold time
SDA and SCL fall time
Data-in hold time
Start condition hold time
Clock HIGH period
Noise suppression time constant at SCL, SDA inputs
Clock LOW period
SDA and SCL rise time
SCL clock frequency
Data-in setup time
Start condition setup time
Stop condition setup time
WRITE cycle time
edge of SDA.
the EEPROM internal erase/program cycle. During the WRITE cycle, the EEPROM bus interface circuit is disabled, SDA
remains HIGH due to pull-up resistor, and the EEPROM does not respond to its slave address.
OUT
SS
SS
IN
; V
; V
= 3mA
OUT
= GND to V
DDSPD
DDSPD
DD
= GND to V
= +2.3V to +3.6V
- 0.3V; All other inputs = V
= +2.3V to +3.6V
t
WRC) is the time from a valid stop condition of a write sequence to the end of
DD
DD
21
128MB (x64, SR), 256MB (x64, DR)
DD
or V
Micron Technology, Inc., reserves the right to change products or specifications without notice.
SYMBOL
SS
t
t
t
t
t
HD:DAT
HD:STA
SU:DAT
SU:STO
SU:STA
t
t
t
t
HIGH
LOW
f
WRC
t
t
BUF
SCL
AA
DH
t
t
t
SYMBOL
F
R
I
V
DDSPD
Vih
V
I
V
I
I
I
168-PIN SDRAM UDIMM
LO
CC
SB
OL
LI
IL
V
MIN
200
100
0.2
1.3
0.6
0.6
1.3
0.6
0.6
DDSPD
0
MIN
©2003, 2004 Micron Technology, Inc. All rights reserved.
2.3
-1
–
–
–
–
–
MAX
× 0.7 V
300
400
0.9
0.3
50
10
V
UNITS
DDSPD
DDSPD
KHz
ms
µs
µs
ns
ns
µs
µs
µs
ns
µs
µs
ns
µs
µs
MAX
3.6
0.4
10
10
30
2
+ 0.5
× 0.3
NOTES
UNITS
1
2
2
3
4
mA
µA
µA
µA
V
V
V
V