MT16LSDT3264AG-133G3 Micron Technology Inc, MT16LSDT3264AG-133G3 Datasheet - Page 15

• Manufacturer Part Number: MT16LSDT3264AG-133G3
• Description: MODULE SDRAM 256MB 168-DIMM
• Manufacturer: Micron Technology Inc

Specifications of MT16LSDT3264AG-133G3

• Memory Type: SDRAM
• Memory Size: 256MB
• Speed: 133MHz
• Package / Case: 168-DIMM
• Main Category: DRAM Module
• Sub-category: SDRAM
• Module Type: 168UDIMM
• Device Core Size: 64b
• Organization: 32Mx64
• Total Density: 256MByte
• Chip Density: 128Mb
• Access Time (max): 6/5.4ns
• Maximum Clock Rate: 133MHz
• Operating Supply Voltage (typ): 3.3V
• Operating Current: 1.216A
• Number Of Elements: 16
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Operating Temp Range: 0C to 65C
• Operating Temperature Classification: Commercial
• Pin Count: 168
• Mounting: Socket
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Table 14: Capacitance – 128MB
Table 15: Capacitance – 256MB
09005aef80bccbe7
SD8_16C16_32x64AG.fm - Rev. E 12/05 EN
PARAMETER
PARAMETER
Input Capacitance: Command and Address
Input Capacitance: CK
Input Capacitance: S#
Input Capacitance: CKE
Input Capacitance: DQMB
Input/Output Capacitance: DQ
Input Capacitance: Command and Address
Input Capacitance: CK
Input Capacitance: S#
Input Capacitance: CKE
Input Capacitance: DQMB
Input/Output Capacitance: DQ
15
128MB (x64, SR), 256MB (x64, DR)
Micron Technology, Inc., reserves the right to change products or specifications without notice.
SYMBOL
SYMBOL
168-PIN SDRAM UDIMM
CIO
CIO
CI1
CI2
CI3
CI4
CI5
CI1
CI2
CI3
CI4
CI5
©2003, 2004 Micron Technology, Inc. All rights reserved.
MIN
MIN
13.3
13.3
2.5
20
10
20
40
10
20
4
5
8
MAX
MAX
30.4
17.3
15.2
30.4
60.8
17.3
15.2
30.4
3.8
7.6
12
6
UNITS
UNITS
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF