MT18VDDT6472AY-335K1 Micron Technology Inc, MT18VDDT6472AY-335K1 Datasheet

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MT18VDDT6472AY-335K1

Manufacturer Part Number
MT18VDDT6472AY-335K1
Description
MODULE DDR 512MB 167MHZ 184-DIMM
Manufacturer
Micron Technology Inc
Datasheet

Specifications of MT18VDDT6472AY-335K1

Memory Type
DDR SDRAM
Memory Size
512MB
Speed
333MT/s
Package / Case
184-DIMM
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
DDR SDRAM UDIMM
MT18VDDT6472A – 512MB
MT18VDDT12872A – 1GB
For component data sheets, refer to Micron’s Web site:
Features
• 184-pin, unbuffered dual in-line memory module
• Fast data transfer rates: PC2100, PC2700, or PC3200
• 512MB (64 Meg x 72) and 1GB (128 Meg x 72)
• Supports ECC error detection and correction
• Vdd = VddQ = +2.5V
• Vddspd = +2.3V to +3.6V
• 2.5V I/O (SSTL_2-compatible)
• Internal, pipelined double data rate (DDR)
• Bidirectional data strobe (DQS) transmitted/
• Differential clock inputs (CK and CK#)
• Multiple internal device banks for concurrent
• Dual rank
• Selectable burst lengths (BL): 2, 4, or 8
• Auto precharge option
• Auto refresh and self refresh modes: 7.8125µs
• Serial presence-detect (SPD) with EEPROM
• Selectable CAS latency (CL) for maximum
• Gold edge contacts
Table 1:
PDF: 09005aef80814e61/Source: 09005aef807f8acb
DD18C64_128x72A.fm - Rev. D 9/08 EN
(UDIMM)
(-40B: Vdd = VddQ = +2.6V)
2n-prefetch architecture
received with data—that is, source-synchronous
data capture
operation
maximum average periodic refresh interval
compatibility
Speed
Grade
-40B
-26A
-335
-262
-265
Key Timing Parameters
Nomenclature
Products and specifications discussed herein are subject to change by Micron without notice.
Industry
PC3200
PC2700
PC2100
PC2100
PC2100
Notes:
1. The values of
actual DDR SDRAM device specifications are 15ns.
CL = 3
400
Data Rate (MT/s)
1
512MB, 1GB (x72, ECC, DR) 184-Pin DDR SDRAM UDIMM
t
RCD and
CL = 2.5
333
333
266
266
266
t
www.micron.com
RP for -335 modules show 18ns to align with industry specifications;
1
CL = 2
266
266
266
266
200
Figure 1:
Options
• Operating temperature
• Package
• Memory clock, speed, CAS latency
PCB height: 31.75mm (1.25in)
– Commercial (0°C ≤ T
– Industrial (–40°C ≤ T
– 184-pin DIMM (standard)
– 184-pin DIMM (Pb-free)
– 5.0ns (200 MHz), 400 MT/s, CL = 3.0
– 6.0ns (167 MHz), 333 MT/s, CL = 2.5
– 7.5ns (133 MHz), 266 MT/s, CL = 2.0
– 7.5ns (133 MHz), 266 MT/s, CL = 2.0
– 7.5ns (133 MHz), 266 MT/s, CL = 2.5
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1. Not recommended for new designs.
2. Contact Micron for industrial temperature
module offerings.
t
(ns)
RCD
15
18
15
20
20
184-Pin UDIMM (MO-206 R/C B)
(ns)
t
A
A
15
18
15
20
20
RP
2
≤ +85°C)
≤ +70°C)
©2004 Micron Technology, Inc. All rights reserved.
(ns)
t
55
60
60
65
65
RC
1
1
1
Marking
Features
None
-40B
-26A
-335
-262
-265
Notes
G
Y
I
1

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MT18VDDT6472AY-335K1 Summary of contents

Page 1

... RCD and RP for -335 modules show 18ns to align with industry specifications; Micron Technology, Inc., reserves the right to change products or specifications without notice. 1 184-Pin UDIMM (MO-206 R/C B) Marking 2 ≤ +70°C) A ≤ +85° module offerings ...

Page 2

... MT18VDDT6472AG-40B__ 512MB MT18VDDT6472AY-40B__ 512MB MT18VDDT6472AG-335__ 512MB MT18VDDT6472AY-335__ 512MB MT18VDDT6472AG-262__ 512MB MT18VDDT6472AG-26A__ 512MB MT18VDDT6472AY-26A__ 512MB MT18VDDT6472AG-265__ 512MB MT18VDDT6472AY-265__ 512MB Table 4: Part Numbers and Timing Parameters – 1GB Modules Base device: MT46V64M8, Module 2 Part Number Density MT18VDDT12872AG-40B__ 1GB MT18VDDT12872AY-40B__ 1GB MT18VDDT12872AG-335__ 1GB MT18VDDT12872AY-335__ ...

Page 3

Pin Assignments and Descriptions Table 5: Pin Assignments 184-Pin DDR UDIMM Front Pin Symbol Pin Symbol Pin Symbol Pin Symbol 1 Vref 24 DQ17 47 2 DQ0 25 DQS2 48 3 Vss 26 Vss 49 4 DQ1 ...

Page 4

Table 6: Pin Descriptions Symbol Type A0–A12 Input BA0, BA1 Input CK0, CK0#, Input CK1, CK1#, CK2, CK2# CKE0, CKE1 Input DM0–DM8 Input RAS#, CAS#, WE# Input S0#, S1# Input SA0–SA2 Input SCL Input CB0–CB7 DQ0–DQ63 DQS0–DQS8 SDA Vdd/VddQ Supply ...

Page 5

Functional Block Diagram Figure 2: Functional Block Diagram S1# S0# DQS0 DM0 DM CS# DQS DQ DQ0 DQ1 DQ DQ2 DQ DQ DQ3 DQ4 DQ DQ DQ5 DQ6 DQ DQ7 DQ DQS1 DM1 DM CS# DQS DQ8 DQ DQ DQ9 ...

Page 6

... READs and by the memory controller during WRITEs. DQS is edge-aligned with data for READs and center-aligned with data for WRITEs. DDR SDRAM modules operate from differential clock inputs (CK and CK#); the crossing of CK going HIGH and CK# going LOW will be referred to as the positive edge of CK. ...

Page 7

Electrical Specifications Stresses greater than those listed in Table 7 may cause permanent damage to the module. This is a stress rating only, and functional operation of the module at these or any other conditions outside those indicated on the ...

Page 8

... PDF: 09005aef80814e61/Source: 09005aef807f8acb DD18C64_128x72A.fm - Rev. D 9/08 EN 512MB, 1GB (x72, ECC, DR) 184-Pin DDR SDRAM UDIMM ® memory modules are designed to optimize signal integrity through carefully Micron Technology, Inc., reserves the right to change products or specifications without notice. 8 Electrical Specifications Component Speed Grade ...

Page 9

Idd Specifications Table 9: Idd Specifications and Conditions – 512MB (Die Revision K) Values shown for the MT46V32M8 DDR SDRAM only and are computed from values specified in the 256Mb (32 Meg x 8) component data sheet Parameter/Condition Operating one ...

Page 10

Table 10: Idd Specifications and Conditions – 512MB (All Other Die Revisions) Values are for the MT46V32M8 DDR SDRAM only and are computed from values specified in the 256Mb (32 Meg x 8) component data sheet Parameter/Condition Operating one bank ...

Page 11

Table 11: Idd Specifications and Conditions – 1GB Values are for the MT46V64M8 DDR SDRAM only and are computed from values specified in the 512Mb (64 Meg x 8) component data sheet Parameter/Condition Operating one bank active-precharge current ...

Page 12

Serial Presence-Detect Table 12: Serial Presence-Detect EEPROM DC Operating Conditions Parameter/Condition Supply voltage Input high voltage: Logic 1; All inputs Input low voltage: Logic 0; All inputs Output low voltage: Iout = 3mA Input leakage current GND to ...

Page 13

Module Dimensions Figure 3: 184-Pin DDR UDIMM 2.0 (0.079) R (4X 2.5 (0.098) D (2X) 2.3 (0.091) TYP Pin 1 2.21 (0.087) TYP 1.27 (0.05) TYP 1.0 (0.039) TYP U19 U10 U11 Pin 184 49.53 (1.95) TYP Notes: ...

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