MT4LSDT1664HG-13ED1 Micron Technology Inc, MT4LSDT1664HG-13ED1 Datasheet - Page 10

• Manufacturer Part Number: MT4LSDT1664HG-13ED1
• Description: MODULE SDRAM 128MB 144SODIMM
• Manufacturer: Micron Technology Inc

Specifications of MT4LSDT1664HG-13ED1

• Memory Type: SDRAM
• Memory Size: 128MB
• Speed: 133MHz
• Package / Case: 144-SODIMM
• Main Category: DRAM Module
• Sub-category: SDRAM
• Module Type: 144SODIMM
• Device Core Size: 64b
• Organization: 16Mx64
• Total Density: 128MByte
• Chip Density: 256Mb
• Access Time (max): 5.4ns
• Maximum Clock Rate: 133MHz
• Operating Supply Voltage (typ): 3.3V
• Operating Current: 540mA
• Number Of Elements: 4
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Operating Temp Range: 0C to 65C
• Operating Temperature Classification: Commercial
• Pin Count: 144
• Mounting: Socket
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

known operation or incompatibility with future ver-
sions may result.
Operating Mode
M7 and M8 to zero; the other combinations of values
for M7 and M8 are reserved for future use and/or test
modes. The programmed burst length applies to both
READ and WRITE bursts.
because unknown operation or incompatibility with
future versions may result.
09005aef80748a77
SD4C4_8_16X64HG.fm - Rev. C 6/04 EN
Reserved states should not be used, because un-
The normal operating mode is selected by setting
Test modes and reserved states should not be used,
10
Write Burst Mode
M2 applies to both READ and WRITE bursts; when
M9 = 1, the programmed burst length applies to READ
bursts, but write accesses are single-location (non-
burst) accesses.
Table 7:
SPEED
When M9 = 0, the burst length programmed via M0-
-13E
-133
-10E
32MB, 64MB, 128MB (x64, SR)
Micron Technology, Inc., reserves the right to change products or specifications without notice.
144-PIN SDRAM SODIMM
CAS LATENCY = 2
CAS Latency Table
CLOCK FREQUENCY (MHz)
ALLOWABLE OPERATING
133
100
100
©2004 Micron Technology, Inc. All rights reserved.
CAS LATENCY = 3
NA
143
133