TH58512DC-T051(Y) Toshiba, TH58512DC-T051(Y) Datasheet

IC E2PROM NAND 3V 512MBIT FDC22A

TH58512DC-T051(Y)

Manufacturer Part Number
TH58512DC-T051(Y)
Description
IC E2PROM NAND 3V 512MBIT FDC22A
Manufacturer
Toshiba
Datasheet

Specifications of TH58512DC-T051(Y)

Memory Size
64MB
Memory Type
EEPROM - Smart Media
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
TH58512DC
TH58512DCT051Y
TENTATIVE TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS
512-MBIT (64M × 8 BITS) CMOS NAND E
DESCRIPTION
Read-Only Memory (NAND E
static register which allows program and read data to be transferred between the register and the memory cell
array in 528-byte increments. The Erase operation is implemented in a single block unit (16 Kbytes + 512 bytes:
528 bytes × 32 pages).
input/output as well as for command inputs. The Erase and Program operations are automatically executed.
device. This unique ID number is applicable to image files, music files, electronic books, and so on where copyright
protection is required.
in order to maintain compatibility with other SmartMedia
FEATURES
PIN ASSIGNMENT
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general
• The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal
V
The TH58NS512 is a single 3.3-V 512-Mbit (553,648,128) bit NAND Electrically Erasable and Programmable
The TH58NS512 is a serial-type memory device which utilizes the I/O pins for both address and data
The TH58NS512DC is a SmartMedia
The data stored in the TH58NS512DC needs to comply with the data format standardized by the SSFDC Forum
can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the
buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and
to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or
damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the
most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling
Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc..
equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are
neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or
failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy
control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control
instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document
shall be made at the customer’s own risk.
V
CC
Organization
Modes
Mode control
Complies with the SmartMedia
SS
Memory cell array
Register
Page size
Block size
Read, Reset, Auto Page Program,
Auto Block Erase, Status Read
Serial input/output, Command control
Specification and Data Format Specification
issued by the SSFDC Forum
CE
CLE ALE
RE
22
1
21
RY
2
WE
/
BY
20
3
19
WP
4
GND LVD I/O8 I/O7 I/O6 I/O5 V
18
5
(TOP VIEW)
I/O1 I/O2 I/O3 I/O4 V
528 × 64K × 8 × 2
528 × 8
528 bytes
(16K + 512) bytes
17
6
2
16
7
PROM) organized as 528 bytes × 32 pages × 4096 blocks. The device has a 528-byte
15
8
TM
14
9 10 11
Electrical
13
TM
12
with ID and each device has 128 bit unique ID number embedded in the
SS
V
SS
CC
2
PROM (64M BYTE SmartMedia
PIN NAMES
TM
Power supply
Access time
Operating current
Packages
systems.
V
Cell array-register
Serial Read cycle
Read (80-ns cycle)
Program (avg.)
Erase (avg.)
Standby
TH58NS512DC: FDC-22C (Weight: 2.2 g typ.)
CC
I/O1~I/O8
RY
GND
CLE
V
ALE
LVD
V
WE
RE
WP
CE
= 3.3 V ± 0.3 V
CC
/
SS
BY
I/O port
Chip enable
Write enable
Read enable
Command latch enable
Address latch enable
Write protect
Ready/Busy
Ground Input
Low Voltage Detect
Power supply
Ground
TM
is a trademark of Toshiba Corporation.
25 µs max
80 ns min
10 mA typ.
10 mA typ.
10 mA typ.
100 µA max
TH58NS512DC
2000-08-27 1/33
TM
)
000707EBA2

Related parts for TH58512DC-T051(Y)

TH58512DC-T051(Y) Summary of contents

Page 1

... It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. ...

Page 2

... The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. ...

Page 3

VALID BLOCKS (1) SYMBOL N Number of Valid Blocks VB (1) The TH58NS512 occasionally contains unusable blocks. Refer to Application Note (14) toward the end of this document. RECOMMENDED DC OPERATING CONDITIONS SYMBOL V Power Supply Voltage CC V High ...

Page 4

AC CHARACTERISTICS AND OPERATING CONDITIONS ( 0°~55° 3.3 V ± ± ± ± 0 SYMBOL t CLE Setup Time CLS t CLE Hold Time CLH t CE Setup Time ...

Page 5

Notes: (1) CE High to Ready time depends on the pull-up resistor tied to the (Refer to Application Note (7) toward the end of this document.) (2) Sequential Read is terminated when t If the delay is ...

Page 6

TIMING DIAGRAMS Latch Timing Diagram for Command/Address/Data CLE ALE I/O1 ~I/O8 Command Input Cycle Timing Diagram CLE t CLS ALS ALE I/O1 ~I/O8 Setup time CLH ...

Page 7

Address Input Cycle Timing Diagram t CLS CLE ALS ALE I/O1 ~I/O8 Data Input Cycle Timing Diagram CLE CE t ALS ALE WE I/O1 ~I/ ...

Page 8

Serial Read Cycle Timing Diagram REA I/O1 ~I/ Status Read Cycle Timing Diagram CLE t CLS I/O1 ~I/ ...

Page 9

Read Cycle (1) Timing Diagram CLE t t CLS CLH ALS t ALH ALE I/O1 00H A0~A7 ~I/O8 Column address ...

Page 10

Read Cycle (2) Timing Diagram CLE t t CLS CLH ALH ALS ALE I/O1 01H ~I/ Read Operation using 01H Command N: 0~255 ...

Page 11

Sequential Read (1) Timing Diagram CLE CE WE ALE RE I/O1 A0 00H ~A7 ~A16 ~I/O8 Column address Sequential Read (2) Timing Diagram CLE CE WE ALE RE I/O1 A0 01H ~A7 ~A16 ~I/O8 Column address ...

Page 12

Sequential Read (3) Timing Diagram CLE CE WE ALE RE I/O1 A0 50H ~A7 ~A16 ~I/O8 Column address A17 A25 ~A24 Page t 512 + 512 + R address Page ...

Page 13

Auto-Program Operation Timing Diagram t CLS CLE t t CLS CLH ALH t ALS ALE I/O1 A9 80H A0~A7 ~A16 ~I/O8 RY ...

Page 14

ID Read Operation Timing Diagram CLE t CLS ALH ALE I/O1 90H ~I/O8 t CLS ALS ALH AR1 t ...

Page 15

PIN FUNCTIONS The device is a serial access memory which utilizes time-sharing input of address information. The device pin-outs are configured as shown in Figure 1. Command Latch Enable: CLE The CLE input signal is used to control loading of ...

Page 16

Schematic Cell Layout and Address Assignment The Program operation works on page units while the Erase operation works on block units. 512 16 131072 pages 4096 blocks 528 Figure 2. Schematic Cell Layout Table 1. Addressing I/O8 I/O7 First cycle ...

Page 17

Table 3. Command table (HEX) First Cycle Serial Data Input 80 Read Mode (1) 00 Read Mode (2) 01 Read Mode (3) 50 Reset FF Auto Program 10 Auto Block Erase 60 Status Read 70 ID Read 90 Once the ...

Page 18

DEVICE OPERATION Read Mode (1) Read mode (1) is set when a 00H command is issued to the Command register. Refer to Figure 3 below for timing details and the block diagram. CLE CE WE ALE ...

Page 19

Read Mode (3) Read mode (3) has the same timing as Read modes (1) and (2) but is used to access information in the extra 16-byte redundancy area of the page. The start pointer is therefore set to a value ...

Page 20

Status Read The device automatically implements the execution and verification of the Program and Erase operations. The Status Read function is used to monitor the Ready/Busy status of the device, determine the result (pass/fail Program or Erase operation, ...

Page 21

Auto Page Program The device carries out an Automatic Page Program operation when it receives a 10H Program command after the address and data have been input. The sequence of command, address and data input is shown below. (Refer to ...

Page 22

Reset The Reset mode stops all operations. For example, in the case of a Program or Erase operation the internally generated voltage is discharged to 0 volts and the device enters Wait state. The address and data registers are set ...

Page 23

When a Status Read command (70H) is input after a Reset However, the following operation is prohibited. If the following operation is executed, correct resetting of the address and data register cannot be guaranteed ...

Page 24

ID Read The TH58NS512 contains ID codes which identify the device type and the manufacturer. The ID codes can be read out under the following timing conditions: CLE CE WE ALE RE I/O 90H ID Read command Address For the ...

Page 25

APPLICATION NOTES AND COMMENTS (1) Prohibition of unspecified commands The operation commands are listed in Table 3. Input of a command other than those specified in Table 3 is prohibited. Stored data may be corrupted if an unknown command is ...

Page 26

Acceptable commands after Serial Input command 80H Once the Serial Input command 80H has been input, do not input any command other than the Program Execution command 10H or the Reset command FFH Address input RY / ...

Page 27

termination for the Ready/Busy pin ( A pull-up resistor needs to be used for termination because the circuit Device V SS Figure 19. This data may vary from device to device. ...

Page 28

Note regarding the WP signal The Erase and Program operations are automatically reset when WP goes Low. The operations are enabled and disabled as follows: Enable Programming WE DIN (100 ns min) WW Disable ...

Page 29

When four address cycles are input Although the device may read in a fourth address ignored inside the chip. Read operation CLE CE WE ALE I/O 00H, 01H, 50H Internal read operation starts when ...

Page 30

Several programming cycles on the same page (Partial Page Program) A page can be divided into segments. Each segment can be programmed individually as follows: First programming Data Pattern 1 Second programming All 1s Tenth programming ...

Page 31

Invalid blocks (bad blocks) The device contains unusable blocks. Therefore, the following issues must be recognized: Bad Block Bad Block Figure 26. (15) Failure phenomena for Program and Erase operations The device may fail during a Program or Erase ...

Page 32

... Avoid touching the connectors avoid damage from static electricity. This card should be kept in the antistatic film case when not in use. (3) Toshiba cannot accept, and hereby disclaims liability for, any damage to the card including data corruption that may occur because of mishandling. How to read out unique ID number The 128 bit unique ID number is embedded in the device ...

Page 33

PACKAGE DIMENSIONS • FDC-22C TH58NS512DC Unit: mm 2000-08-27 33/33 ...

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