TH58NS100DC Toshiba, TH58NS100DC Datasheet

IC E2PROM NAND 3.3V 1-GB FDC22A

TH58NS100DC

Manufacturer Part Number
TH58NS100DC
Description
IC E2PROM NAND 3.3V 1-GB FDC22A
Manufacturer
Toshiba
Datasheet

Specifications of TH58NS100DC

Memory Size
128MB
Memory Type
EEPROM - Smart Media
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
TH58NS100DC-TO51
TH58NS100DC-TO51
TH58NS100DCTO51
TENTATIVE TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS
1-GBIT (128M × 8 BITS) CMOS NAND E
DESCRIPTION
Read-Only Memory (NAND E
static register which allows program and read data to be transferred between the register and the memory cell
array in 528-byte increments. The Erase operation is implemented in a single block unit (16 Kbytes + 512 bytes:
528 bytes × 32 pages).
input/output as well as for command inputs. The Erase and Program operations are automatically executed.
device. This unique ID number is applicable to image files, music files, electronic books, and so on where copyright
protection is required.
in order to maintain compatibility with other SmartMedia
FEATURES
PIN ASSIGNMENT
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general
• The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal
V
The TH58NS100 is a single 3.3-V 1-Gbit (1,107,296,256) bit NAND Electrically Erasable and Programmable
The TH58NS100 is a serial-type memory device which utilizes the I/O pins for both address and data
The TH58NS100DC is a SmartMedia
The data stored in the TH58NS100DC needs to comply with the data format standardized by the SSFDC Forum
can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the
buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and
to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or
damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the
most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling
Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc..
equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are
neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or
failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy
control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control
instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document
shall be made at the customer’s own risk.
V
CC
Organization
Modes
Mode control
Complies with the SmartMedia
SS
Memory cell array
Register
Page size
Block size
Read, Reset, Auto Page Program,
Auto Block Erase, Status Read
Serial input/output, Command control
Specification and Data Format Specification
issued by the SSFDC Forum
CE
CLE ALE
RE
22
1
21
RY
2
WE
/
BY
20
3
19
WP
4
GND LVD I/O8 I/O7 I/O6 I/O5 V
18
5
(TOP VIEW)
I/O1 I/O2 I/O3 I/O4 V
528 × 128K × 8 × 2
528 × 8
528 bytes
(16K + 512) bytes
17
6
2
16
7
PROM) organized as 528 bytes × 32 pages × 8192 blocks. The device has a 528-byte
15
8
TM
14
9 10 11
Electrical
13
TM
12
with ID and each device has 128 bit unique ID number embedded in the
SS
V
SS
CC
2
PROM (128M BYTE SmartMedia
PIN NAMES
TM
Power supply
Program/Erase Cycles
Access time
Operating current
Package
systems.
Cell array-register
Serial Read cycle
Read (50-ns cycle)
Program (avg.)
Erase (avg.)
Standby
FDC-22C (Weight: 2.2 g typ.)
I/O1 to I/O8
RY
GND
CLE
V
ALE
LVD
V
WE
RE
WP
CE
CC
/
SS
BY
I/O port
Chip enable
Write enable
Read enable
Command latch enable
Address latch enable
Write protect
Ready/Busy
Ground Input
Low Voltage Detect
Power supply
Ground
TM
is a trademark of Toshiba Corporation.
V
1E5 cycle (with ECC)
25 µs max
50 ns min
10 mA typ.
10 mA typ.
10 mA typ.
100 µA max
CC
TH58NS100DC
2001-03-21 1/43
= 3.3 V ± 0.3 V
TM
)
000707EBA2

Related parts for TH58NS100DC

TH58NS100DC Summary of contents

Page 1

... The TH58NS100DC is a SmartMedia device. This unique ID number is applicable to image files, music files, electronic books, and so on where copyright protection is required. The data stored in the TH58NS100DC needs to comply with the data format standardized by the SSFDC Forum in order to maintain compatibility with other SmartMedia FEATURES Organization • ...

Page 2

... The information contained herein is subject to change without notice. Status register Address register Command register Control circuit HV generator PARAMETER PARAMETER CONDITION OUT TH58NS100DC Column buffer Column decoder Data register Sense amp Memory cell array extended area (embedded ID) RATING −0.6 to 4.6 −0.6 to 4.6 − ...

Page 3

... IL OUT cycle = cycle = cycle = cycle   − 0 −400 µ 2 0 pin V OL TH58NS100DC MIN TYP. MAX  8032 8192 MIN TYP. MAX 3.0 3.3 3.6  + 0.3 2 −0.3*  0.8 MIN TYP. MAX   ±10   ±  ...

Page 4

... CE High to Ready (When interrupted Read Mode) CRY t Device Reset Time (Read/Program/Erase) RST AC TEST CONDITIONS PARAMETER Input level Input pulse rise and fall time Input comparison level Output data comparison level Output load PARAMETER TH58NS100DC MIN MAX UNIT     ...

Page 5

... Refer to Application Note (12) toward the end of this document. is greater than or equal to 100 ns. If the CEH signal stays Ready. t CEH 526 527 A Busy MIN      TH58NS100DC pin. ≥ 100 → Busy signal is not output CRY ( 0° to 55° 3.3 V ± ± ± ± 0 TYP. MAX UNIT µ ...

Page 6

... TIMING DIAGRAMS Latch Timing Diagram for Command/Address/Data CLE ALE I/O1 to I/O8 Command Input Cycle Timing Diagram CLE t CLS ALS ALE I/O1 to I/O8 Setup Time CLH ALH TH58NS100DC Hold Time 2001-03-21 6/43 ...

Page 7

... Address Input Cycle Timing Diagram t CLS CLE ALS ALE I/O1 to I/O8 Data Input Cycle Timing Diagram CLE CE t ALS ALE WE I/ A16 TH58NS100DC ALH A17 to A24 A25 to A26 : CLH 527 2001-03-21 7/43 ...

Page 8

... Serial Read Cycle Timing Diagram REA I/ Status Read Cycle Timing Diagram CLE t CLS I/ 70H represents the hexadecimal number REH RHZ REA RHZ t CLS t CLH WHC CSTO t WHR 70H* TH58NS100DC CHZ REA RHZ t CHZ RSTO RHZ Status output : 2001-03-21 8/43 ...

Page 9

... Column address Read operation using 00H command 255 t t ALH AR2 A17 A25 to A24 to A26 t t ALH AR2 A17 A25 to A24 to A26 TH58NS100DC REA OUT OUT OUT OUT 527 : CHZ RHZ t t REA OUT OUT OUT 2001-03-21 9/43 t CEH t CRY t RB ...

Page 10

... DH I/O1 50H to I/O8 Column address Read operation using 50H command ALH A17 A25 A16 to A24 to A26 N* t ALH A17 A25 A16 to A24 to A26 N* TH58NS100DC t AR2 REA D D OUT OUT 256 + N 256 + AR2 REA D D OUT OUT 512 + N 512 + 2001-03-21 10/43 D OUT ...

Page 11

... CE WE ALE RE I/O1 A0 01H to to I/O8 A7 Column address A17 A25 A16 A24 A26 Page t R address M Page M access A9 A17 A25 A16 A24 A26 Page t 256 + 256 + R address Page M access TH58NS100DC 527 Page access : 527 256 + Page access : 2001-03-21 11/43 527 527 ...

Page 12

... Sequential Read (3) Timing Diagram CLE CE WE ALE RE I/O1 A0 50H I/O8 Column address A17 A25 A16 A24 A26 Page t 512 + 512 + R address Page M access TH58NS100DC 527 512 513 514 t 512 + Page access : 2001-03-21 12/43 527 ...

Page 13

... IN to A24 to A26 : not input data while data is being output ALH WB BERASE A25 D0H to A26 Erase Start Busy command : not input data while data is being output TH58NS100DC t PROG 10H 70H 527 Status output 70H Status output Status Read command 2001-03-21 13/43 ...

Page 14

... CLS CLH ALH t ALS ALE I/ 80H /O8 to A16 ALH t ALS A17 A25 A26 to A24 Max 3 times repeat 31 times repeat (Page programming in multi block) Max 4 blocks programming TH58NS100DC t DBSY t WB 11H 80H D 527 IN Auto program (dummy) Last district input 2 2001-03-21 14/ ...

Page 15

... Do not input data while data is being output. times repeat 2 t ALH t ALS A17 A25 A26 to A24 Auto program (multi block program) Last district input 31 times repeat (Page programming in multi block) Max 4 blocks programming TH58NS100DC t MBPBSY t WB 15H 80H D 527 IN 3 Max 3 times repeat 2001-03-21 15/ ...

Page 16

... A7 to I/O8 to A16 not input data while data is being output ALH t ALS A17 A25 A26 to A24 Max 3 times repeat (Last pages programming in multi block) Max 4 blocks programming TH58NS100DC t DBSY t WB 11H 80H D 527 IN Auto program (dummy) 4 Last district input 2001-03-21 16/ ...

Page 17

... Do not input data while data is being output. 4 Max 3 times repeat t ALH t ALS A17 A25 A26 to A24 Last district input (Last pages programming in multi block) Max 4 blocks programming TH58NS100DC t Prog 10H 71H D 527 IN Auto program (true) 5 Status read 2001-03-21 17/43 Status output ...

Page 18

... WE t ALS ALE I/ A17 to 60H A16 A24 to I/O8 Auto Block Erase Setup command Max 4 times repeat : not input data while data is being output ALH WB BERASE A25 to D0H A26 Erase Start Busy command TH58NS100DC 71H Status output Status Read command 2001-03-21 18/43 ...

Page 19

... ID Read (2) Operation Timing Diagram CLE t CLS t CLS ALH ALS ALE I/O1 91H to I/ ALH AR1 t REAID 00 98H Address Maker code input ALH AR1 t REAID 00 21H Address input TH58NS100DC REAID REAID REAID 79H A5H C0H Device code Option code (1) Option code ( 2001-03-21 19/43 ...

Page 20

... after completion of the operation. The output buffer for this signal is an open drain. Low Voltage Detect: LVD The LVD signal is used to detect the power supply voltage level L), such as during a Program or Erase operation, and will not enter REA TH58NS100DC CLE ALE WE WP ...

Page 21

... Table 1. 8I/O I/O6 I/O5 I/O4 I/O3 I/ A14 A13 A12 A11 A10 A22 A21 A20 A19 A18 A26 * CLE ALE TH58NS100DC I/ Column address A26 : Page address A9 A14 to A26 : Block address A9 to A13 : NAND address in block A17 A25 2001-03-21 21/ ...

Page 22

... Second Cycle Acceptable while Busy         D0     ALE TH58NS100DC HEX data bit assignment (Example) Serial Data Input: 80H I/ I/O1 I/O1 to I/O8 Power L Output Active H High impedance Active High impedance Standby * 2001-03-21 22/43 ...

Page 23

... The operation of the device after input of the 01H command is the same as that of Read mode (1). If the start pointer set after column address 256, use Read mode (2). However, for a Sequential Read, output of the next page Cell array starts from column address 0. TH58NS100DC 2001-03-21 23/43 ...

Page 24

... A4-to-A7 address. (A “00H” command is necessary to move the pointer back to the 0-to-511 main memory cell location.) Data output t R Busy Busy (01H) 256 527 A Sequential Read (2) TH58NS100DC Data output Busy (50H) 512 527 A Sequential Read (3) 2001-03-21 24/43 ...

Page 25

... Device 2 3 Busy 70H Status on Device 1 Figure 6. Status Read timing application example pin signals from multiple devices are wired together as shown in the TH58NS100DC The Pass/Fail status on I/O1 is only valid when the device is in the Ready state Device N Status on Device N 2001-03-21 25/ ...

Page 26

... After programming, the programmed data is transferred back to the register to be automatically verified by the device. If the programming does not succeed, the Program/Verify operation is repeated by the device until success is achieved or until the maximum loop number set in the device is reached. D0 Busy TH58NS100DC Pass 70 I/O Status Read Fail command ...

Page 27

... Dummy Data input Program command command Address Data input Address input 0 to 527 input (District 1) (District 2) TH58NS100DC Dummy Multi block Data input Program Program command command command Data input Address Data input 0 to 527 input 0 to 527 11 80 ...

Page 28

... Pass: 0 Fail: 1 Pass: 0 Fail: 1 Pass: 0 Fail: 1 Pass: 0 Fail not care Ready: 1 Busy: 0 Protect: 0 Not Protect: 1 TH58NS100DC I/O1 describes total Pass/Fail condition least one fail occurred in 32 times × 4 (512 + 16 byte) page write operation, it shows “Fail” condition. I/O2 describes total Pass/Fail condition. ...

Page 29

... Status Read operation Untill the Ready condition after the programming terminated by “10H” command, effective bit in the Status data is limited on Ready/Busy bit. In other words, Pass/Fail condition can be checked only in the Ready condition after “10H” command. TH58NS100DC 2001-03-21 29/43 ...

Page 30

... Fail: 1 Pass: 0 Fail not care Ready: 1 Busy: 0 Protect: 0 Not Protect: 1 TH58NS100DC I/O1 describes total Pass/Fail condition least one fail occurred in Max 4 Blocks erase operation, it shows “Fail” condition. I/O2 describes Pass/Fail condition. If fail occurred in District 0 area, it shows “Fail” condition. I/O3, I/O4 and I/O5 are as same manner as I/O2 ...

Page 31

... The second FF (max 10 µs) t RST (max 6 µs) t RST command is invalid, but the third TH58NS100DC Figure 8. 00 Figure 9. 00 (max 500 µs) RST Figure 10. 00 Figure 11. I/O status: Pass/Fail → Pass Ready/Busy → Ready I/O status: Ready/Busy → Busy Figure 12. ( command is valid ...

Page 32

... CR t AR1 t REAID 98H Maker code , t and t refer to the AC Characteristics. REAID CR AR1 Figure 13. ID Read timing I/O7 I/O6 I/O5 I/ TH58NS100DC 79H A5H Device code Option code (1) Option code (2) I/O3 I/O2 I/O1 Hex Data 98H 79H A5H C0H** 2001-03-21 32/43 C0H ...

Page 33

... For the specifications of the access times t Table 7. ID Codes read out by command 91H I/O8 I/O7 Extended ID code AR1 t REAID 21H Extended ID code , t and t refer to the AC Characteristics. REAID CR AR1 Figure 14. ID Read timing I/O6 I/O5 I/O4 I/ TH58NS100DC I/O2 I/O1 Hex Data 0 1 21H 2001-03-21 33/43 ...

Page 34

... V and CE signal is kept high Operation Figure 15. Power-on/off Sequence becomes 2 recommends starting access after about CC FF Reset Figure 16. 10 For this operation the “FFH” command is needed. TH58NS100DC Don’t care V IL 2001-03-21 34/43 ...

Page 35

... Read mode. In this case, data output starts automatically from address N and address input is unnecessary Ex.) Random page program (Prohibition) DATA IN: Data (1) Page 0 (1) Page 1 (2) (3) Page 2 Page 15 Page 31 Figure 17. page programming within a block 70 Status Read command input Figure 18. TH58NS100DC Data (32) Data register (2) (16) (3) (1) (32) 00 [A] Status Read Status output 2001-03-21 35/43 ...

Page 36

... C area C area Add Start point B area A area Add DIN Start point C Area Add DIN Start point B Area Figure 20. Example of How to Set the Pointer TH58NS100DC 255 256 511 512 A B Pointer control Figure 19. Pointer control 50H Add Start point C area 00H Add ...

Page 37

... This data may vary from device to device. We recommend that you use this data as a reference when selecting a resistor value Ready 1.5 µs 1.0 µ 0.5 µ KΩ TH58NS100DC buffer consists of an open drain 3.0 V Busy 1 3 25° 100 KΩ 3 KΩ 4 KΩ ...

Page 38

... The Erase and Program operations are automatically reset when WP goes Low. The operations are enabled and disabled as follows: Enable Programming WE DIN (100 ns min) WW Disable Programming WE DIN (100 ns min) WW Enable Erasing WE DIN (100 ns min) WW Disable Erasing WE DIN (100 ns min TH58NS100DC 2001-03-21 38/43 ...

Page 39

... Although the device may read in a fifth address ignored inside the chip. Read operation CLE CE WE ALE I/O 00H, 01H or 50H Program operation CLE CE WE ALE I/O 80H Address input WE Internal read operation starts when WE goes High in the fourth cycle. Figure 22. Address input ignored Figure 23. TH58NS100DC ignored Data input 2001-03-21 39/43 ...

Page 40

... Busy state. (Refer to Figure 25.) I/O 00H/01H/50H Hence the RE clock input must start after the address input. All 1s Data Pattern 2 All 1s Data Pattern 2 Figure 24. Address input Figure 25. TH58NS100DC All 1s Data Pattern 3 Data Pattern 3 2001-03-21 40/43 ...

Page 41

... When an error happens in Block A, try to reprogram the data into another (Block B) by loading from an external buffer. Then, prevent Block A further system accesses to Block A (by creating a bad block table or by using an another appropriate scheme). Block B Figure 27. TH58NS100DC TYP. MAX UNIT  8192 Block TM . ...

Page 42

... Some electrical specifications in this data sheet show differences from the Forum’s electrical specification. Complying with the Forum’s electrical specification maintains compatibility with other SmartMedias. Please refer following SSFDC Forum’s URL to get the detailed information of each specification. URL http://www.ssfdc.or. especially with large capacity SmartMedia TH58NS100DC small removable TM . 2001-03-21 42/43 ...

Page 43

... PACKAGE DIMENSIONS Weight: 2.2 g (typ.) TH58NS100DC 2001-03-21 43/43 ...

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