TLP168J(TPR,U,C,F) Toshiba, TLP168J(TPR,U,C,F) Datasheet - Page 24

PHOTOCOUPLER TRIAC OUT 4-MSOP

TLP168J(TPR,U,C,F)

Manufacturer Part Number
TLP168J(TPR,U,C,F)
Description
PHOTOCOUPLER TRIAC OUT 4-MSOP
Manufacturer
Toshiba
Datasheets

Specifications of TLP168J(TPR,U,C,F)

Voltage - Isolation
2500Vrms
Number Of Channels
1
Voltage - Off State
600V
Output Type
AC, Triac, Zero Cross
Current - Gate Trigger (igt) (max)
3mA
Current - Hold (ih)
600µA
Current - Dc Forward (if)
6mA
Current - Output / Channel
70mA
Mounting Type
Surface Mount
Package / Case
4-SMD
Output Device
PhotoTriac
Isolation Voltage
2500 V
Peak Output Voltage (vdrm)
600 V
Maximum Input Voltage
240 VAC
Maximum Output Voltage
600 V
Configuration
1 Channel
Maximum Continuous Output Current
70 mA
Maximum Input Current
7.5 mA
Maximum Operating Temperature
+ 100 C
Maximum Reverse Diode Voltage
5 V
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Zero-crossing Circuit
Yes
Number Of Elements
1
Forward Voltage
1.7V
Repetitive Peak Off-state Volt
600V
Operating Temp Range
-10C to 85C
Output Current
70mA
Package Type
MFSOP
Reverse Breakdown Voltage
5V
Mounting
Surface Mount
Pin Count
4
Trigger Current
3mA
Zero Crossing Circuit
Yes
Operating Temperature Classification
Commercial
Forward Current
20mA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
TLP168J(TPR,U,C,F))
TLP168JFTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TLP168J(TPR,U,C,F)
Quantity:
1 100
4
Photocouplers for IGBT/MOSFET Gate Drive
*Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation)
TLP151*
TLP151A*
TLP155E
TLP2451
TLP2451A*
TLP350
TLP350F
TLP350H*
TLP350HF*
TLP351
TLP351F
TLP351A*
TLP351AF*
TLP351H*
TLP351HF*
TLP352*
TLP352F*
Part Number
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
TÜV and VDE: : Approved
For the latest information, please contact your nearest Toshiba sales representative.
Selection Guide
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
EN 60747-5-2-approved with option V4 or D4
Pin Configuration
8
1
8
1
8
1
8
1
8
1
8
1
8
1
6
1
6
1
7
2
7
2
7
2
7
2
7
2
7
2
7
2
5
5
6
3
6
3
6
3
: Design which meets safety standard/approval pending as of January 2011
6
3
6
3
6
3
6
3
4
3
4
3
5
4
5
4
5
4
5
4
5
4
5
4
5
4
SO6 (reinforced Insulation)
T
Direct drive of a
small-power
IGBT/MOSFET
SO6 (reinforced Insulation)
T
Direct drive of a
small-power
IGBT/MOSFET
SO8
T
Direct drive of a
small-power
IGBT/MOSFET
High CMR
DIP8
Direct drive of a
medium-power
IGBT/MOSFET
High CMR
Low power dissipation
DIP8
T
Direct drive of a
medium-power
IGBT/MOSFET
High CMR
DIP8
Direct drive of a
small-power
IGBT/MOSFET
Low power dissipation
DIP8
Direct drive of a
medium-power
IGBT/MOSFET
Low power dissipation
T
DIP8
Direct drive of a
medium-power
IGBT/MOSFET
Low power dissipation
DIP8
T
Direct drive of a
small-power
IGBT/MOSFET
High CMR
opr
opr
opr
opr
opr
opr
= 110°C (max)
= 100°C (max)
= 125°C (max)
= 125°C (max)
= 125°C (max)
= 125°C (max)
Features
: Approved (reinforced insulation)
Delay Time (Max)
Propagation
0.7 μs
0.5 μs
0.2 μs
0.7 μs
0.5 μs
0.5 μs
0.5 μs
0.7 μs
0.7 μs
0.7 μs
0.2 μs
24
current (max):
current (max):
current (max):
current (max):
current (max):
current (max):
current (max):
current (max):
current (max):
Peak output
Peak output
Peak output
Peak output
Peak output
Peak output
Peak output
Peak output
Peak output
Output
±0.6 A
±0.6 A
±0.6 A
±2.5 A
±2.5 A
±2.5 A
±0.6 A
±0.6 A
±6.0 A
: Design which meets safety standard/approval pending as of January 2011
5 mA
7.5 mA
5 mA
5 mA
5 mA
(Max)
5 mA
5 mA
5 mA
5 mA
I
FHL
Vrms
Vrms
Vrms
Vrms
Vrms
3750
3750
3750
3750
3750
3750
Vrms
3750
Vrms
3750
Vrms
3750
Vrms
BVs
UL/cUL TÜV
/
/
/
/
/
/
/
/
/
/
/
Safety Standards
VDE
(1)
(1)
BSI
(2)
IEC

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