VO3063 Vishay, VO3063 Datasheet - Page 2

• Manufacturer Part Number: VO3063
• Description: PHOTOTRIAC ZC 600V 5MA 6DIP
• Manufacturer: Vishay

Specifications of VO3063

• No. Of Channels: 1
• Input Current: 30mA
• Output Voltage: 600V
• Opto Case Style: DIP
• No. Of Pins: 6
• Isolation Voltage: 5.3kV
• Voltage - Isolation: 5300Vrms
• Number Of Channels: 1
• Voltage - Off State: 600V
• Output Type: AC, Triac, Zero Cross
• Current - Gate Trigger (igt) (max): 5mA
• Current - Hold (ih): 200µA
• Current - Dc Forward (if): 60mA
• Current - Output / Channel: 100mA
• Mounting Type: Through Hole
• Package / Case: 6-DIP (0.300", 7.62mm)
• Optocoupler Output Type: Phototriac
• Input Current Max: 30mA
• Number Of Elements: 1
• Output Device: Triac
• Forward Voltage: 1.5V
• Repetitive Peak Off-state Volt: 600V
• Operating Temp Range: -40C to 100C
• Output Current: 100mA
• Package Type: PDIP
• Reverse Breakdown Voltage: 6V
• Mounting: Through Hole
• Pin Count: 6
• Trigger Current: 5mA
• Zero Crossing Circuit: Yes
• Operating Temperature Classification: Industrial
• Forward Current: 60mA
• Power Dissipation: 300mW
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 751-1383-5; VO3063

VO3062, VO3063
Vishay Semiconductors
Notes
(1)
(2)
Note
The thermal model is represented in the thermal network below. Each resistance value given in this model can be used to calculate the
temperatures at each node for a given operating condition. The thermal resistance from board to ambient will be dependent on the type of PCB,
layout and thickness of copper traces. For a detailed explanation of the thermal model, please reference Vishay’s Thermal Characteristics of
Optocouplers application note.
www.vishay.com
928
ABSOLUTE MAXIMUM RATINGS
PARAMETER
COUPLER
Isolation test voltage
Total power dissipation
Operating temperature range
Storage temperature range
Soldering temperature
THERMAL CHARACTERISTICS
PARAMETER
Maximum LED junction temperature
Maximum output die junction temperature
Thermal resistance, junction emitter to board
Thermal resistance, junction emitter to case
Thermal resistance, junction detector to board
Thermal resistance, junction detector to case
Thermal resistance, junction emitter to
junction detector
Thermal resistance, case to ambient
ELECTRICAL CHARACTERISTCS
PARAMETER
INPUT
Reverse current
Forward voltage
OUTPUT
Leakage with LED off, either direction
Critical rate of rise off-state voltage
T
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not
implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute maximum
ratings for extended periods of the time can adversely affect reliability.
Refer to reflow profile for soldering conditions for surface mounted devices (SMD). Refer to wave profile for soldering conditions for through
hole devices (DIP).
amb
= 25 °C, unless otherwise specified.
(2)
For technical questions, contact:
TEST CONDITION
TEST CONDITION
V
maximum ≤ 10 s
V
I
DRM
SYMBOL
F
V
D
(1)
= 30 mA
R
T
T
θ
θ
θ
θ
θ
= 400 V
θ
jmax.
jmax.
t = 1 s
JEB
JEC
JDB
JDC
JED
= 6 V
= 600 V
CA
Phototriac, Zero Crossing,
1.5 kV/µs dV/dt, 600 V
VALUE
3563
125
125
150
139
103
496
78
[e-mail]
PART
PART
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
UNIT
°C
°C
SYMBOL
dV/dt
I
DRM
V
I
R
F
SYMBOL
V
T
P
T
T
amb
ISO
stg
sld
tot
T
1500
19996
MIN.
JD
θ
DB
θ
DC
- 40 to + 100
- 55 to + 150
TYP.
2000
T
T
T
VALUE
B
1.2
C
A
θ
10
5300
DE
Document Number: 83748
300
260
T
θ
θ
A
CA
BA
Package
Rev. 1.8, 03-Sep-09
θ
EC
MAX.
θ
EB
500
1.5
10
T
JE
UNIT
V
mW
°C
°C
°C
RMS
UNIT
V/µs
µA
nA
V