TLP112(TPR,F) Toshiba, TLP112(TPR,F) Datasheet - Page 42
![TRANSCOUPLER HS TRANS OUT 5-MSOP](/photos/7/66/76686/264-5-mfsop_black_sml.jpg)
TLP112(TPR,F)
Manufacturer Part Number
TLP112(TPR,F)
Description
TRANSCOUPLER HS TRANS OUT 5-MSOP
Manufacturer
Toshiba
Specifications of TLP112(TPR,F)
Number Of Channels
1
Input Type
DC
Voltage - Isolation
2500Vrms
Current Transfer Ratio (min)
10% @ 16mA
Voltage - Output
15V
Current - Output / Channel
8mA
Current - Dc Forward (if)
25mA
Output Type
Transistor with Vcc
Mounting Type
Surface Mount
Package / Case
5-MSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Vce Saturation (max)
-
Current Transfer Ratio (max)
-
Other names
TLP112FTR
6
The DIP4, DIP6, DIP8 and DIP16 packages offer three surface-mount lead form options and a wide-spaced lead form option. The
electrical characteristics are identical, regardless of these options.
Example 1: Standard part: TLP620(F)
1
Package Information
Lead Form Options for DIP Packages
Surface-mount option: TLP620(LF1,F): Packed in stick magazines (see page 49).
Surface-mount and tape-and-reel options: TLP620(TP1,F): Packed in tape-and-reel (see page 51).
■ Standard part names should be used when applying for safety standard approval.
■ The package dimensions and lead form options of the TLP781, TLP785 differ from those shown above.
Carrier Tape Code
Package Outlines
Lead Form Code
See the TLP781, TLP785 datasheet.
Appearance
Lead Form
6-pin DIP
4-pin DIP
6
1 2
Dimensions
All other package dimensions are the same as for each standard package
specification.
Dimension
4 3
1
5
2
(TP1)
(LF1)
4
3
A
B
C
Version
16
1
8
1
Min
6.4
16-pin DIP
8-pin DIP
–
(0.35 typ.)
(LF1)
42
Surface-Mount
Max
10.0
5
–
4
(TP4)
(LF4)
9
8
Min
8.0
–
(0.25 typ.)
B
(LF4)
Max
12.0
–
Min
6.4
–
–
* Tape-and-reel packing is not available with (LF2).
(LF5)
(TP5)
A
C
(LF5)
Unit: mm
Max
10.0
0.2
–
Not available*
Wide-Spaced
10 to 12
(LF2)
10.16