TLP126(F) Toshiba, TLP126(F) Datasheet - Page 65

PHOTOCPLR AC-IN TRANS-OUT 4-SMD

TLP126(F)

Manufacturer Part Number
TLP126(F)
Description
PHOTOCPLR AC-IN TRANS-OUT 4-SMD
Manufacturer
Toshiba
Datasheets

Specifications of TLP126(F)

Number Of Channels
1
Input Type
AC, DC
Voltage - Isolation
3750Vrms
Current Transfer Ratio (min)
100% @ 1mA
Current Transfer Ratio (max)
1200% @ 1mA
Voltage - Output
80V
Current - Output / Channel
50mA
Current - Dc Forward (if)
50mA
Vce Saturation (max)
400mV
Output Type
Transistor
Mounting Type
Surface Mount
Package / Case
4-SMD
Configuration
1
Maximum Collector Emitter Voltage
80 V
Maximum Collector Emitter Saturation Voltage
400 mV
Isolation Voltage
3750 Vrms
Current Transfer Ratio
1200 %
Maximum Forward Diode Voltage
1.3 V
Minimum Forward Diode Voltage
1 V
Maximum Collector Current
50 mA
Maximum Power Dissipation
200 mW
Maximum Operating Temperature
+ 75 C
Minimum Operating Temperature
- 25 C
Maximum Input Diode Current
50 mA
Output Device
Transistor
No. Of Channels
1
Optocoupler Output Type
Phototransistor
Input Current
1.6mA
Output Voltage
80V
Opto Case Style
Mini-Flat
No. Of Pins
4
Approval Bodies
UL
Rohs Compliant
Yes
Number Of Elements
1
Forward Voltage
1.3V
Forward Current
50mA
Collector-emitter Voltage
80V
Package Type
MFSOP
Collector Current (dc) (max)
50mA
Power Dissipation
200mW
Collector-emitter Saturation Voltage
0.4V
Pin Count
4
Mounting
Surface Mount
Operating Temp Range
-25C to 75C
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
TLP126F

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TLP126(F)
Manufacturer:
Toshiba
Quantity:
40 199
10
Toshiba offers a wide selection of photocouplers with a transistor output, IC output, thyristor output and triac output, as well as photore-
lays certified to UL (USA), cUL (Canada), VDE (Germany), BSI (Britain) and SEMKO (Sweden).
Safety Standard Approvals for Photocouplers
The table above lists photocouplers and photorelays that have already been approved as of January 2011. The information herein is subject to change. For the latest
information, please contact your nearest Toshiba sales representative.
Construction
Mechanical
60747-5-2
VDE/TÜV
Certified
Devices
Ratings
(min)
Mechanical Construction
DIN
EN
Construction
Package
Internal
Isolation Clearance
Isolation Thickness
Isolation Creepage
Working Insulation
Internal Creepage
Transistor Output
Highest Allowable
Safety Standard Approvals
Voltage (Viorm)
Triac/Thyrsitor
Overvoltage
Photorelay
Path (mm)
IC Output
Path (mm)
(Viotm)
Output
(mm)
(mm)
Max.
TLP280
TLP280-4
TLP281
TLP281-4
4000 Vpk
565 Vpk
4.0
4.0
0.4
SOP4/SOP16
LED Chip
Reflective Photocouplers in
Single-Molded Packages
Coupling Medium
TLP284
TLP284-4
TLP285
TLP285-4
(Window)
6000 Vpk
707 Vpk
5.0
5.0
0.4
Photo Detector Chip
TLP180
TLP181
TLP260J
TLP261J
Package
(Body)
6000 Vpk
MFSOP6
565 Vpk
4.0
4.0
0.4
Lead
65
TLP127
TLP160G
TLP160J
TLP161G
TLP161J
(DIN EN60747-5-2)
MFSOP6
4000 Vpk
565 Vpk
4.0
4.0
Photo Detector Chip
Transmissive Photocouplers in Single-Molded Packages
TLP2105
TLP2108
TLP2166A
TLP2116
TLP2117
4000 Vpk
565 Vpk
(2 ch)
SO8
4.2
4.2
TLP176A
TLP176D
TLP176G
TLP197G
TLP206G
LED Chip
2500 Vpk
2.54SOP
565 Vpk
4/6/8
4.0
4.0
Coupling Medium
(Window)
TLP350
TLP351
TLP560G
TLP560J
TLP561G
TLP561J
TLP227G
TLP227G-2
TLP597G
4000 Vpk
/890 Vpk
630 Vpk
6.4/7.0
6.4/7.0
(0.4)
DIP
Package
(Body)
Lead
TLP350F
TLP351F
1140 Vpk
6000 Vpk
(F type)
(0.4)
DIP
8.0
8.0

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