HCPL-M701-000E Avago Technologies US Inc., HCPL-M701-000E Datasheet - Page 4

• Manufacturer Part Number: HCPL-M701-000E
• Description: OPTOCOUPLER 100KBD CMOS/TTL SO-5
• Manufacturer: Avago Technologies US Inc.

Specifications of HCPL-M701-000E

• Voltage - Isolation: 3750Vrms
• Number Of Channels: 1, Unidirectional
• Current - Output / Channel: 60mA
• Propagation Delay High - Low @ If: 25µs @ 500µA
• Current - Dc Forward (if): 20mA
• Input Type: DC
• Output Type: Logic
• Mounting Type: Surface Mount
• Package / Case: 5-SOP
• Voltage - Output: 18V
• Current Transfer Ratio (max): 2600% @ 1.6mA
• Current Transfer Ratio (min): 400% @ 1.6mA
• No. Of Channels: 1
• Optocoupler Output Type: Photodarlington
• Input Current: 1.6mA
• Output Voltage: 18V
• Opto Case Style: SOIC
• No. Of Pins: 5
• Ctr Max: 3500%
• Isolation Voltage: 3.75kV
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Vce Saturation (max): -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Solder Reflow Thermal Profile
Recommended Pb-Free IR Profile
4
TEMPERATURE
ROOM
T
T
smax
smin
300
200
100
T
T
25
0
p
L
0
Note: Non-halide flux should be used.
Note: Non-halide flux should be used.
150 - 200 °C
217 °C
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
t 25 °C to PEAK
3 °C/SEC. MAX.
60 to 180 SEC.
PREHEAT
RAMP-UP
t
s
50
260 +0/-5 °C
3°C + 1°C/–0.5°C
150°C, 90 + 30 SEC.
PREHEATING TIME
TIME
2.5°C ± 0.5°C/SEC.
t
t
L
100
p
TIME (SECONDS)
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
RAMP-DOWN
6 °C/SEC. MAX.
TEMP.
PEAK
245°C
150
SEC.
SEC.
30
30
NOTES:
THE TIME FROM 25 °C to PEAK
TEMPERATURE = 8 MINUTES MAX.
T
smax
50 SEC.
SOLDERING
= 200 °C, T
200°C
TIME
200
PEAK
TEMP.
240°C
smin
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
= 150 °C
250