ACPL-847-000E Avago Technologies US Inc., ACPL-847-000E Datasheet - Page 6

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ACPL-847-000E

Manufacturer Part Number
ACPL-847-000E
Description
ISOLATOR 5KVRMS 4CH TRANS 16-DIP
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of ACPL-847-000E

Output Type
Transistor
Input Type
DC
Package / Case
16-DIP (0.300", 7.62mm)
Number Of Channels
4
Voltage - Isolation
5000Vrms
Current Transfer Ratio (min)
50% @ 5mA
Current Transfer Ratio (max)
600% @ 5mA
Voltage - Output
70V
Current - Output / Channel
50mA
Current - Dc Forward (if)
50mA
Vce Saturation (max)
200mV
Mounting Type
Through Hole
Maximum Fall Time
18 us
Maximum Input Diode Current
5 mA
Maximum Reverse Diode Voltage
6 V
Maximum Rise Time
18 us
Output Device
Phototransistor
Configuration
4 Channel
Maximum Collector Emitter Voltage
70 V
Maximum Collector Emitter Saturation Voltage
0.2 V
Isolation Voltage
5000 Vrms
Current Transfer Ratio
50 %
Maximum Forward Diode Voltage
1.4 V
Maximum Collector Current
50 mA
Maximum Power Dissipation
200 mW
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 30 C
No. Of Channels
4
Optocoupler Output Type
Phototransistor
Input Current
20mA
Output Voltage
70V
Opto Case Style
DIP
No. Of Pins
16
Breakdown Voltage
70V
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ACPL-847-000E
Manufacturer:
AVAGO/安华高
Quantity:
20 000
ACPL-847 Package Outline - Option W00
PIN ONE DOT
DIMENSIONS IN [MILLIMETERS] AND INCHES
ACPL-847 Package Outline - Option 300
PIN ONE DOT
DIMENSIONS IN [MILLIMETERS] AND INCHES
Solder Reflow Temperature Profile
1. One-time soldering reflow is recommended within
2. When using another soldering method such as
Note: Non-halide flux should be used.
6
LEAD FREE
LEAD FREE
1.20 ±0.10
0.05 ±0.00
the condition of temperature and time profile shown
at right.
infrared ray lamp, the temperature may rise partially
in the mold of the device. Keep the temperature on
the package of the device within the condition of (1)
above.
2.80 ±0.50
0.11 ±0.02
2.54 ±0.25
0.10 ±0.01
19.84 ±0.50
0.781 ±0.020
YYWW
A 847
YYWW
19.84 ±0.50
0.781 ±0.020
A 847
2.54 ±0.25
0.10 ±0.01
DATE CODE
DATE CODE
RANK
RANK
0.256 ±0.020
0.138 ±0.020
6.50 ±0.50
3.50 ±0.50
0.50 ±0.10
0.02 ±0.00
0.256 ±0.020
6.50 ±0.50
0.138 ±0.020
3.50 ±0.50
0.35 ±0.25
0.01 ±0.01
25°C
150°C
0.039 ±0.010
1 ±0.25
10.16 ±0.50
7.62 ±0.30
0.30 ±0.01
0.40 ±0.02
60 ~ 150 sec
200°C
10.16 ±0.30
7.62 ±0.30
0.30 ±0.01
0.40 ±0.01
217°C
Time (sec)
250°C
0.272 ±0.020
6.90 ±0.50
90 sec
60 sec
260 °C (Peak Temperature)
30 seconds
60 sec
0.26
0.01

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