ACPL-217-56CE Avago Technologies US Inc., ACPL-217-56CE Datasheet - Page 3

• Manufacturer Part Number: ACPL-217-56CE
• Description: ISOLATOR 3KVRMS 1CH TRANS SO-4
• Manufacturer: Avago Technologies US Inc.
• Series: -r

Specifications of ACPL-217-56CE

• Output Type: Transistor
• Input Type: DC
• Package / Case: SO-4
• Number Of Channels: 1
• Voltage - Isolation: 3000Vrms
• Current Transfer Ratio (min): 200% @ 5mA
• Current Transfer Ratio (max): 400% @ 5mA
• Voltage - Output: 80V
• Current - Output / Channel: 50mA
• Current - Dc Forward (if): 50mA
• Vce Saturation (max): 400mV
• Mounting Type: Surface Mount
• Maximum Fall Time: 3 us
• Maximum Input Diode Current: 5 mA
• Maximum Reverse Diode Voltage: 6 V
• Maximum Rise Time: 2 us
• Output Device: Phototransistor
• Configuration: 1 Channel
• Maximum Collector Emitter Voltage: 80 V
• Maximum Collector Emitter Saturation Voltage: 0.4 V
• Isolation Voltage: 3000 Vrms
• Current Transfer Ratio: 50 %
• Maximum Forward Diode Voltage: 1.4 V
• Maximum Collector Current: 50 mA
• Maximum Power Dissipation: 200 mW
• Maximum Operating Temperature: + 110 C
• Minimum Operating Temperature: - 55 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Solder Reflow Temperature Profile
Note: Non halide flux should be used.
Absolute Maximum Ratings
3
25 °C
Parameter
Storage Temperature
Operating Temperature
Average Forward Current
Pulse Forward Current
Reverse Voltage
LED Power Dissipation
Collector Current
Collector-Emitter Voltage
Emitter-Collector Voltage
Isolation Voltage (AC for 1min, R.H. 40~60%)
Collector Power Dissipation
Total Power Dissipation
Lead Solder Temperature
150 °C
60 ~ 150 sec
200 °C
217 °C
Time (sec)
250 °C
90 sec
60 sec
260 °C (Peak Temperature)
30 seconds
60 sec
Symbol
T
T
I
I
V
P
I
V
V
V
P
P
60°C for 10 sec., 1.6 mm below seating plane
F(AVG)
FSM
C
A
S
R
I
CEO
ECO
ISO
C
TOT
ACPL-217
-55~15
-55~110
50
1
6
65
50
80
7
3000
150
00
1. One-time soldering reflow is recommended within the
2. When using another soldering method such as
condition of temperature and time profile shown at
right.
infrared ray lamp, the temperature may rise partially
in the mold of the device. Keep the temperature on
the package of the device within the condition of (1)
above.
Units
°C
°C
mA
A
V
mW
mA
V
V
V
mW
mW
RMS
Note
1min