HCPL-181-00DE Avago Technologies US Inc., HCPL-181-00DE Datasheet - Page 3

OPTOCOUPLER PHOTOTRANS 4-MINIPAK

HCPL-181-00DE

Manufacturer Part Number
HCPL-181-00DE
Description
OPTOCOUPLER PHOTOTRANS 4-MINIPAK
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of HCPL-181-00DE

Number Of Channels
1
Input Type
DC
Voltage - Isolation
3750Vrms
Current Transfer Ratio (min)
50% @ 5mA
Current Transfer Ratio (max)
300% @ 5mA
Voltage - Output
80V
Current - Output / Channel
50mA
Current - Dc Forward (if)
50mA
Vce Saturation (max)
200mV
Output Type
Transistor
Mounting Type
Surface Mount
Package / Case
4-Miniflat
No. Of Channels
1
Optocoupler Output Type
Phototransistor
Input Current
20mA
Output Voltage
80V
Opto Case Style
SOIC
No. Of Pins
4
Ctr Max
600%
Isolation Voltage
3.75kV
Output Device
Transistor
Number Of Elements
1
Reverse Breakdown Voltage
6V
Forward Voltage
1.4V
Forward Current
50mA
Collector-emitter Voltage
80V
Package Type
Mini Flat
Collector Current (dc) (max)
50mA
Power Dissipation
170mW
Collector-emitter Saturation Voltage
0.2V
Current Transfer Ratio
600%
Fall Time
18000ns
Rise Time
18000ns
Pin Count
4
Mounting
Surface Mount
Operating Temp Range
-55C to 100C
Operating Temperature Classification
Industrial
Ctr Min
300%
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HCPL-181-00DE
Quantity:
66 000
Part Number:
HCPL-181-00DE
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Part Number:
HCPL-181-00DE
0
Company:
Part Number:
HCPL-181-00DE
Quantity:
9 000
Company:
Part Number:
HCPL-181-00DE
Quantity:
1 089
Package Outline Drawings
HCPL-181-000E
HCPL-181-060E
Solder Reflow Temperature Profile
1. One-time soldering reflow is recommended within
2. When using another soldering method such as infrared
3
LEAD
LEAD
FREE
FREE
the condition of temperature and time profile shown
at right.
ray lamp, the temperature may rise partially in the mold
of the device. Keep the temperature on the package
of the device within the condition of (1) above.
DIMENSIONS IN MILLIMETERS.
DIMENSIONS IN MILLIME
181
181 V
± 0.25
± 0.25
2.54
Y W W
2.54
Y W W
TERS.
4.40 ± 0.2
4.40 ± 0.2
D ATE C ODE
RANK
D ATE C ODE
RANK
3.60 ± 0.3
3.60 ± 0.3
0.40 ± 0.1
0.40 ± 0.1
25 ° C
Note: Non-halide flux should be used.
2.00 ± 0.2
2.00 ± 0.2
150 ° C
0.10 ± 0.1
0.10 ± 0.1
60 ~ 150 sec
200 ° C
217 ° C
Time(sec)
7.00
7.00
250 ° C
5.30 ± 0.3
5.30 ± 0.3
+ 0.2
– 0.7
+ 0.2
– 0.7
90 sec
60 sec
260 ° C (Peak Temperature)
30 seconds
60 sec
0.2 ± 0.05
0.2 ± 0.05

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