HCPL-3760-000E Avago Technologies US Inc., HCPL-3760-000E Datasheet - Page 5

OPTOCOUPLER AC/DC LOGIC 8-DIP

HCPL-3760-000E

Manufacturer Part Number
HCPL-3760-000E
Description
OPTOCOUPLER AC/DC LOGIC 8-DIP
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of HCPL-3760-000E

Output Type
Open Collector
Package / Case
8-DIP (0.300", 7.62mm)
Voltage - Isolation
3750Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
30mA
Propagation Delay High - Low @ If
4.5µs
Current - Dc Forward (if)
50mA
Input Type
Logic
Mounting Type
Through Hole
Logic Gate Type
AC / DC to Logic Interface Optocouplers
Configuration
1 Channel
Isolation Voltage
3750 Vrms
Maximum Propagation Delay Time
40000 ns
Maximum Forward Diode Voltage
50 mA
Maximum Forward Diode Current
2.2 mA
Maximum Continuous Output Current
30 mA
Maximum Power Dissipation
305 mW
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
No. Of Channels
1
Optocoupler Output Type
Photodarlington
Input Current
1.8mA
Output Voltage
20V
Opto Case Style
DIP
No. Of Pins
8
Common Mode Ratio
4000
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
516-1677-5

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HCPL-3760-000E
Manufacturer:
AVAGO
Quantity:
5 000
Part Number:
HCPL-3760-000E
Manufacturer:
AVAGO/安华高
Quantity:
20 000
5
Solder Reflow Thermal Profile
Recommended Pb-Free IR Profile
Regulatory Information
The HCPL-0370/3700/3760 has been approved by the following organizations:
IEC/EN/DIN EN 60747-5-5 (with option 060)
Maximum Working Insulation Voltage V
for HCPL-0370, and 630 Vpeak for HCPL3700/3760.
Highest Allowable Overvoltage V
HCPL-0370/3700/3760.
Note: Non-halide flux should be used.
Note: Non-halide flux should be used.
TEMPERATURE
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
T
T
smax
ROOM
smax
smin
T
T
25
p
L
= 200 °C, T
150 - 200 °C
217 °C
300
200
100
0
0
t 25 °C to PEAK
PREHEATING RATE 3¡C + 1¡C/Ð0.5¡C/SEC.
REFLOW HEATING RATE 2.5¡C ± 0.5¡C/SEC.
160¡C
150¡C
140¡C
3 °C/SEC. MAX.
60 to 180 SEC.
smin
PREHEAT
IOTM
RAMP-UP
= 150 °C
t
s
= 6000 Vpeak for
260 +0/-5 °C
50
IORM
3¡C + 1¡C/Ð0.5¡C
TIME
= 567 Vpeak
PREHEATING TIME
150¡C, 90 + 30 SEC.
2.5¡C ± 0.5¡C/SEC.
t
t
L
p
100
TIME (SECONDS)
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
15 SEC.
60 to 150 SEC.
RAMP-DOWN
6 °C/SEC. MAX.
TEMP.
245¡C
PEAK
UL
Recognized under UL 1577, component recognition
program, File E55361 (HCPL-0370 pending).
CSA
Approved under CSA Component Acceptance Notice
#5, File CA 88324.
150
SEC.
SEC.
30
30
50 SEC.
SOLDERING
200¡C
TIME
200
PEAK
TEMP.
240¡C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230¡C
250

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