HCPL-0723 Avago Technologies US Inc., HCPL-0723 Datasheet - Page 5
![OPTOCOUPLER CMOS 50MBD 8-SOIC](/photos/7/65/76546/516-8-soic_sml.jpg)
HCPL-0723
Manufacturer Part Number
HCPL-0723
Description
OPTOCOUPLER CMOS 50MBD 8-SOIC
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HCPL-7723-300.pdf
(12 pages)
Specifications of HCPL-0723
Voltage - Isolation
3750Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
10mA
Data Rate
50MBd
Propagation Delay High - Low @ If
16ns
Input Type
Logic
Output Type
Push-Pull, Totem-Pole
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154", 3.90mm Width)
No. Of Channels
1
Isolation Voltage
3.75kV
Optocoupler Output Type
Logic Gate
Input Current
10µA
Output Voltage
5V
Opto Case Style
SOIC
No. Of Pins
8
Propagation Delay Low-high
22ns
Common Mode Voltage Vcm
1000V
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
516-1109-5
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HCPL-0723
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Part Number:
HCPL-0723-000E
Manufacturer:
BROADCOM
Quantity:
20 000
Part Number:
HCPL-0723-500E
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Company:
Part Number:
HCPL-0723-560E
Manufacturer:
OMRON
Quantity:
2 000
Solder Reflow Temperature Profile
TEMPERATURE
Recommended Pb-Free IR Profile
Insulation and Safety Related Specifications
Parameter
Minimum External Air Gap
(Clearance)
Minimum External Tracking
(Creepage)
Minimum Internal Plastic Gap
(Internal Clearance)
Tracking Resistance
(Comparative Tracking Index)
Isolation Group
5
ROOM
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
T
T
smax
smax
smin
300
200
100
T
T
25
p
L
0
= 200 °C, T
0
Note: Non-halide flux should be used.
Note: Non-halide flux should be used.
150 - 200 °C
217 °C
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
t 25 °C to PEAK
3 °C/SEC. MAX.
60 to 180 SEC.
smin
PREHEAT
RAMP-UP
= 150 °C
t
50
s
3°C + 1°C/–0.5°C
260 +0/-5 °C
150°C, 90 + 30 SEC.
PREHEATING TIME
TIME
Symbol
L(I01)
L(I02)
CTI
2.5°C ± 0.5°C/SEC.
100
TIME (SECONDS)
t
t
L
p
7723
7.1
7.4
0.08
≥ 175
IIIa
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
TEMP.
PEAK
245°C
RAMP-DOWN
6 °C/SEC. MAX.
Value
150
0723
4.9
4.8
0.08
≥ 175
IIIa
SEC.
SEC.
30
30
50 SEC.
SOLDERING
200°C
Units
mm
mm
mm
Volts
TIME
200
PEAK
TEMP.
240°C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
Conditions
Measured from input terminals to output
terminals, shortest distance through air.
Measured from input terminals to output
terminals, shortest distance path along body.
Insulation thickness between emitter and
detector; also known as distance through
insulation.
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
250
Regulatory Information
The HCPL-7723/0723 have been
approved by the following organi-
zations:
UL
Recognized under UL1577,
component recognition program,
File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File
CA88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997+A1:2002/
EN 60747-5-2:2001+A1:2002/
DIN EN 60747-5-2 (VDE 0884
(Option 060 only)
Teil 2): 2003-01.