HCPL-7723-020E Avago Technologies US Inc., HCPL-7723-020E Datasheet - Page 7

• Manufacturer Part Number: HCPL-7723-020E
• Description: OPTOCOUPLER 50MBD 2NS UL 8-DIP
• Manufacturer: Avago Technologies US Inc.

Specifications of HCPL-7723-020E

• Package / Case: 8-DIP (0.300", 7.62mm)
• Voltage - Isolation: 5000Vrms
• Number Of Channels: 1, Unidirectional
• Current - Output / Channel: 10mA
• Data Rate: 50MBd
• Propagation Delay High - Low @ If: 16ns
• Input Type: Logic
• Output Type: Push-Pull, Totem-Pole
• Mounting Type: Through Hole
• Isolation Voltage: 3750 Vrms
• Maximum Continuous Output Current: 10 mA
• Maximum Fall Time: 6 ns
• Maximum Rise Time: 8 ns
• Output Device: Logic Gate Photo IC
• Configuration: 1 Channel
• Maximum Baud Rate: 50 MBps
• Maximum Power Dissipation: 150 mW
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Number Of Elements: 1
• Baud Rate: 50Mbps
• Output Current: 10mA
• Package Type: PDIP
• Operating Temp Range: -40C to 85C
• Power Dissipation: 150mW
• Propagation Delay Time: 22ns
• Pin Count: 8
• Mounting: Through Hole
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Absolute Maximum Ratings
Parameter
Storage Temperature
Ambient Operating Temperature
Supply Voltages
Input Voltage
Output Voltage
Average Output Current
Lead Solder Temperature
Solder Reflow Temperature Profile
Recommended Operating Conditions
Parameter
Ambient Operating Temperature
Supply Voltages
Logic High Input Voltage
Logic Low Input Voltage
Input Signal Rise and Fall Times
Electrical Specifications
Test conditions that are not specified can be anywhere within the recommended operating range.
All typical specifications are at T
Parameter
Logic Low Input Supply Current
Logic High Input Supply Current
Output Supply Current
Input Current
Logic High Output Voltage
Logic Low Output Voltage
7
[2]
A
[2]
[1]
= +25°C, V
DD1
= V
DD2
= +5 V.
Symbol
I
I
I
I
I
V
V
DD1L
DD1H
DD2L
DD2H
I
OH
OL
Symbol
T
T
V
V
V
I
260°C for 10 sec., 1.6 mm below seating plane
See Solder Reflow Temperature Profile Section
Symbol
T
V
V
V
t
O
A
A
r,
S
DD1
I
O
DD1
IH
IL
t
f
, V
, V
Min.
–10
4.4
4.0
DD2
DD2
Typ.
7
1.8
12.5
12
5.0
4.8
0
0.5
Min.
–55
–40
0
–0.5
Min.
–40
4.5
2.0
0.0
–0.5
Max.
10
3
17.5
16.5
10
0.1
1.0
Max.
125
85
6.0
V
V
10
Max.
85
5.5
V
0.8
1.0
DD1
DD2
DD1
Units
mA
mA
mA
mA
µA
V
V
V
V
+0.5
+0.5
Test Conditions
V
V
I
I
I
I
O
O
O
O
I
I
= 0 V
= V
= –20 µA, V
= –4 mA, V
= 20 µA, V
= 4 mA, V
Units
°C
°C
Volts
Volts
Volts
mA
Units
°C
V
V
V
ms
DD1
I
I
= V
= V
I
I
= V
= V
IL
IL
IH
IH