HCPL-7723-560 Avago Technologies US Inc., HCPL-7723-560 Datasheet - Page 7

OPTOCOUPLER 50MBD 2NS VDE 8-SMD

HCPL-7723-560

Manufacturer Part Number
HCPL-7723-560
Description
OPTOCOUPLER 50MBD 2NS VDE 8-SMD
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of HCPL-7723-560

Package / Case
8-SMD Gull Wing
Voltage - Isolation
3750Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
10mA
Data Rate
50MBd
Propagation Delay High - Low @ If
16ns
Input Type
Logic
Output Type
Push-Pull, Totem-Pole
Mounting Type
Surface Mount, Gull Wing
Isolation Voltage
3750 Vrms
Maximum Continuous Output Current
10 mA
Maximum Fall Time
6 ns
Maximum Rise Time
8 ns
Output Device
Logic Gate Photo IC
Configuration
1 Channel
Maximum Baud Rate
50 MBps
Maximum Power Dissipation
150 mW
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Number Of Elements
1
Baud Rate
50Mbps
Output Current
10mA
Package Type
PDIP SMD
Operating Temp Range
-40C to 85C
Power Dissipation
150mW
Propagation Delay Time
22ns
Pin Count
8
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Contains lead / RoHS non-compliant
Absolute Maximum Ratings
Parameter
Storage Temperature
Ambient Operating Temperature
Supply Voltages
Input Voltage
Output Voltage
Average Output Current
Lead Solder Temperature
Solder Reflow Temperature Profile
Recommended Operating Conditions
Parameter
Ambient Operating Temperature
Supply Voltages
Logic High Input Voltage
Logic Low Input Voltage
Input Signal Rise and Fall Times
Electrical Specifications
Test conditions that are not specified can be anywhere within the recommended operating range.
All typical specifications are at T
Parameter
Logic Low Input Supply Current
Logic High Input Supply Current
Output Supply Current
Input Current
Logic High Output Voltage
Logic Low Output Voltage
7
[2]
A
[2]
[1]
= +25°C, V
DD1
= V
DD2
= +5 V.
Symbol
I
I
I
I
I
V
V
DD1L
DD1H
DD2L
DD2H
I
OH
OL
Symbol
T
T
V
V
V
I
260°C for 10 sec., 1.6 mm below seating plane
See Solder Reflow Temperature Profile Section
Symbol
T
V
V
V
t
O
A
A
r,
S
DD1
I
O
DD1
IH
IL
t
f
, V
, V
Min.
–10
4.4
4.0
DD2
DD2
Typ.
7
1.8
12.5
12
5.0
4.8
0
0.5
Min.
–55
–40
0
–0.5
Min.
–40
4.5
2.0
0.0
–0.5
Max.
10
3
17.5
16.5
10
0.1
1.0
Max.
125
85
6.0
V
V
10
Max.
85
5.5
V
0.8
1.0
DD1
DD2
DD1
Units
mA
mA
mA
mA
µA
V
V
V
V
+0.5
+0.5
Test Conditions
V
V
I
I
I
I
O
O
O
O
I
I
= 0 V
= V
= –20 µA, V
= –4 mA, V
= 20 µA, V
= 4 mA, V
Units
°C
°C
Volts
Volts
Volts
mA
Units
°C
V
V
V
ms
DD1
I
I
= V
= V
I
I
= V
= V
IL
IL
IH
IH

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