HCPL-2531-000E Avago Technologies US Inc., HCPL-2531-000E Datasheet - Page 6

OPTOCOUPLR T-OUT 2CH 1MBD 8-DIP

HCPL-2531-000E

Manufacturer Part Number
HCPL-2531-000E
Description
OPTOCOUPLR T-OUT 2CH 1MBD 8-DIP
Manufacturer
Avago Technologies US Inc.
Type
Analogr
Datasheets

Specifications of HCPL-2531-000E

Input Type
DC
Package / Case
8-DIP (0.300", 7.62mm)
Voltage - Isolation
3750Vrms
Number Of Channels
2, Unidirectional
Current - Output / Channel
8mA
Data Rate
1MBd
Propagation Delay High - Low @ If
200ns @ 16mA
Current - Dc Forward (if)
25mA
Output Type
Open Collector
Mounting Type
Through Hole
Isolation Voltage
3750 Vrms
Maximum Continuous Output Current
8 mA
Maximum Forward Diode Current
25 mA
Output Device
Transistor With Base
Configuration
2 Channel
Current Transfer Ratio
50 %
Maximum Baud Rate
1 MBps
Maximum Forward Diode Voltage
1.8 V
Maximum Reverse Diode Voltage
5 V
Maximum Input Diode Current
25 mA
Maximum Power Dissipation
45 mW
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 55 C
Package Type
8-Pin DIP
Special Features
2 Channel
No. Of Channels
2
Optocoupler Output Type
Phototransistor
Input Current
16mA
Output Voltage
20V
Opto Case Style
DIP
No. Of Pins
8
Ctr Max
50%
Ctr Min
19%
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
516-1474-5

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HCPL-2531-000E
Manufacturer:
PANASONIC
Quantity:
2 000
Part Number:
HCPL-2531-000E
Manufacturer:
AVAGO
Quantity:
40 000
Part Number:
HCPL-2531-000E
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Recommended Pb-Free IR Profile
Solder Reflow Thermal Profile
Regulatory Information
UL
6
TEMPERATURE
ROOM
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
T
T
smax
smax
smin
300
200
100
T
T
25
p
L
0
= 200 °C, T
0
Note: Non-halide flux should be used.
Note: Non-halide flux should be used.
150 - 200 °C
217 °C
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
t 25 °C to PEAK
3 °C/SEC. MAX.
60 to 180 SEC.
smin
PREHEAT
RAMP-UP
= 150 °C
50
t
s
3°C + 1°C/–0.5°C
260 +0/-5 °C
150°C, 90 + 30 SEC.
PREHEATING TIME
TIME
2.5°C ± 0.5°C/SEC.
100
TIME (SECONDS)
t
t
L
p
CSA
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
TEMP.
PEAK
245°C
RAMP-DOWN
6 °C/SEC. MAX.
150
SEC.
SEC.
30
30
50 SEC.
SOLDERING
200°C
TIME
200
PEAK
TEMP.
240°C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
250

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