HCPL-2400#500 Avago Technologies US Inc., HCPL-2400#500 Datasheet - Page 5

• Manufacturer Part Number: HCPL-2400#500
• Description: ISOLAT 3.75KVRMS 1CH UNIDIR 8SMD
• Manufacturer: Avago Technologies US Inc.

Specifications of HCPL-2400#500

• Package / Case: 8-SMD Gull Wing
• Voltage - Isolation: 3750Vrms
• Number Of Channels: 1, Unidirectional
• Current - Output / Channel: 25mA
• Data Rate: 40MBd
• Propagation Delay High - Low @ If: 33ns @ 7mA
• Current - Dc Forward (if): 10mA
• Input Type: DC
• Output Type: Tri-State
• Mounting Type: Surface Mount, Gull Wing
• Isolation Voltage: 3750 Vrms
• Maximum Continuous Output Current: 25 mA
• Maximum Fall Time: 10 ns
• Maximum Forward Diode Current: 10 mA
• Maximum Rise Time: 20 ns
• Minimum Forward Diode Voltage: 1.1 V
• Output Device: Logic Gate Photo IC
• Configuration: 1 Channel
• Maximum Baud Rate: 40 MBps
• Maximum Forward Diode Voltage: 1.5 V
• Maximum Reverse Diode Voltage: 2 V
• Maximum Power Dissipation: 350 mW
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

5
Solder Reflow Thermal Profile
TEMPERATURE
Recommended Pb-Free IR Profile
Regulatory Information
The HCPL-24XX has been approved by the following organizations:
VDE
Approved according to VDE 0884/06.92 (Option 060
only).
UL
Recognized under UL 1577, Component Recognition
Program, File E55361.
ROOM
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
T
T
smax
smax
smin
300
200
100
25
T
T
p
L
0
= 200 °C, T
0
Note: Non-halide flux should be used.
Note: Non-halide flux should be used.
150 - 200 °C
217 °C
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
t 25 °C to PEAK
3 °C/SEC. MAX.
60 to 180 SEC.
smin
PREHEAT
RAMP-UP
= 150 °C
t
50
s
3°C + 1°C/–0.5°C
260 +0/-5 °C
PREHEATING TIME
150°C, 90 + 30 SEC.
TIME
2.5°C ± 0.5°C/SEC.
100
t
TIME (SECONDS)
t
L
p
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
TEMP.
PEAK
245°C
RAMP-DOWN
6 °C/SEC. MAX.
150
SEC.
SEC.
30
30
50 SEC.
SOLDERING
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01.
(Option 060 only)
200°C
TIME
200
PEAK
TEMP.
240°C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
250