HCPL-0708-500E Avago Technologies US Inc., HCPL-0708-500E Datasheet - Page 5

• Manufacturer Part Number: HCPL-0708-500E
• Description: OPTOCOUPLER 15MBD 8-SOIC
• Manufacturer: Avago Technologies US Inc.

Specifications of HCPL-0708-500E

• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Voltage - Isolation: 3750Vrms
• Number Of Channels: 1, Unidirectional
• Current - Output / Channel: 2mA
• Data Rate: 15MBd
• Propagation Delay High - Low @ If: 35ns @ 12mA
• Current - Dc Forward (if): 20mA
• Input Type: DC
• Output Type: Push-Pull, Totem-Pole
• Mounting Type: Surface Mount
• Isolation Voltage: 3750 Vrms
• Maximum Continuous Output Current: 2 mA
• Maximum Fall Time: 25 ns
• Maximum Forward Diode Current: 20 mA
• Maximum Rise Time: 20 ns
• Minimum Forward Diode Voltage: 1.3 V
• Output Device: Logic Gate Photo IC
• Configuration: 1 Channel
• Maximum Baud Rate: 15 MBps
• Maximum Forward Diode Voltage: 1.8 V
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 40 C
• Number Of Elements: 1
• Baud Rate: 15Mbps
• Forward Voltage: 1.8V
• Forward Current: 20mA
• Output Current: 2mA
• Package Type: SOIC
• Operating Temp Range: -40C to 100C
• Propagation Delay Time: 60ns
• Pin Count: 8
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Insulation and Safety Related Specifications
All Avago data sheets report the creepage and clearance
inherent to the optocoupler component itself. These
dimensions are needed as a starting point for the equip-
ment designer when determining the circuit insulation
requirements. However, once mounted on a printed
circuit board, minimum creepage and clearance require-
ments must be met as specified for individual equipment
standards. For creepage, the shortest distance path along

Parameter
Minimum External Air
Gap (Clearance)
Minimum External
Tracking (Creepage)
Minimum Internal Plastic
Gap (Internal Clearance)
Tracking Resistance
(Comparative Tracking Index)
Isolation Group
Symbol
L(I01)
L(I02)
CTI
Value
4.9
4.8
0.08
≥175
IIIa
Units
mm
mm
mm
Volts
the surface of a printed circuit board between the solder
fillets of the input and output leads must be considered.
There are recommended techniques such as grooves
and ribs which may be used on a printed circuit board to
achieve desired creepage and clearances. Creepage and
clearance distances will also change depending on fac-
tors such as pollution degree and insulation level.
Conditions
Measured from input terminals to output
terminals, shortest distance through air.
Measured from input terminals to output
terminals, shortest distance path along body.
Insulation thickness between emitter and
detector; also known as distance through
insulation.
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)