HCPL-2201 Avago Technologies US Inc., HCPL-2201 Datasheet - Page 10
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HCPL-2201
Manufacturer Part Number
HCPL-2201
Description
OPTOCOUPLER LOGIC-OUT 5MBD 8-DIP
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HCPL-0201-500E.pdf
(18 pages)
Specifications of HCPL-2201
Mounting Type
Through Hole
Voltage - Isolation
3750Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
25mA
Data Rate
5MBd
Propagation Delay High - Low @ If
150ns @ 3mA
Current - Dc Forward (if)
10mA
Input Type
DC
Output Type
Push-Pull, Totem-Pole
Package / Case
8-DIP (0.300", 7.62mm)
No. Of Channels
1
Isolation Voltage
3.75kV
Optocoupler Output Type
Logic Gate
Input Current
5mA
Output Voltage
20V
Opto Case Style
DIP
No. Of Pins
8
Propagation Delay
0.3µs
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
516-1057-5
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HCPL-2201
Manufacturer:
AVAGO
Quantity:
7
Part Number:
HCPL-2201
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Company:
Part Number:
HCPL-2201#300
Manufacturer:
AVAGO
Quantity:
3 000
Company:
Part Number:
HCPL-2201#500
Manufacturer:
AVAGO
Quantity:
3 000
Company:
Part Number:
HCPL-2201-000E
Manufacturer:
AVAGO
Quantity:
5 000
Part Number:
HCPL-2201-000E
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Company:
Part Number:
HCPL-2201-060E
Manufacturer:
AVAGO
Quantity:
5 000
Recommended Operating Conditions
*The initial switching threshold is 1.6 mA or less. It is recommended that 2.2 mA be used to permit at least a 20% LED degradation guardband.
†The initial switching threshold is 1.8 mA or less. It is recommended that 2.5 mA be used to permit at least a 20% LED degradation guardband.
10
Absolute Maximum Ratings
Parameter
Power Supply Voltage
Forward Input Current (ON)
Forward Input Voltage (OFF)
Operating Temperature
Junction Temperature
Fan Out
Parameter
Storage Temperature
Operating Temperature
Average Forward Input Current
Peak Transient Input Current
Reverse Input Voltage
Average Output Current
Supply Voltage
Output Voltage
Total Package Power Dissipation
Output Power Dissipation
Lead Solder Temperature (Through Hole Parts Only)
Solder Reflow Temperature Profile
(Surface Mount Parts Only)
(≤ 1 µs Pulse Width, 300 pps)
(≤ 200 µs Pulse Width,
< 1% Duty Cycle)
HCPL-223X
HCNW22XX
HCNW22XX
HCPL-223X
HCNW22XX
Symbol
V
I
V
See Package Outline Drawings section
F(ON)
F(OFF)
T
T
N
Symbol
CC
I
260°C for 10 sec., up to seating plane
A
J
I
F(TRAN)
F(AVG)
V
P
T
T
V
V
P
I
CC
O
A
O
R
O
S
T
1.6 mm below seating plane
260°C for 10 sec.,
Min.
1.6*
1.8†
Min.
-0.5
-40
-40
-40
-55
4.5
0
-
See Figure 7
Max.
125
210
294
1.0
85
10
40
25
20
20
5
3
Max.
125
0.8
20
85
5
4
Units
mW
mA
mA
mA
°C
°C
A
V
V
V
TTL Loads
Units
mA
°C
°C
V
V
Note
1
1
1
1
1
2
1