HCPL-J314-000E Avago Technologies US Inc., HCPL-J314-000E Datasheet - Page 4
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HCPL-J314-000E
Manufacturer Part Number
HCPL-J314-000E
Description
OPTOCOUPLER 1CH 0.6A 8-DIP
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HCPL-J314-500E.pdf
(16 pages)
Specifications of HCPL-J314-000E
Voltage - Isolation
3750Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
600mA
Propagation Delay High - Low @ If
300ns @ 8mA
Current - Dc Forward (if)
25mA
Input Type
DC
Output Type
Push-Pull, Totem-Pole
Mounting Type
Through Hole
Package / Case
8-DIP (0.300", 7.62mm)
No. Of Channels
1
Optocoupler Output Type
Gate Drive
Input Current
12mA
Output Voltage
30V
Opto Case Style
DIP
No. Of Pins
8
Peak Reflow Compatible (260 C)
Yes
Isolation Voltage
3.75kV
Number Of Elements
1
Forward Voltage
1.8V
Forward Current
25mA
Package Type
PDIP
Operating Temp Range
-40C to 100C
Power Dissipation
260mW
Propagation Delay Time
700ns
Pin Count
8
Mounting
Through Hole
Reverse Breakdown Voltage
3V
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HCPL-J314-000E
Manufacturer:
AVAGO
Quantity:
10 000
TEMPERATURE
ROOM
Solder Reflow Temperature Profile
Recommended Pb-Free IR Profile
4
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
T
T
smax
smax
smin
300
200
100
T
T
25
0
p
L
= 200 °C, T
0
Note: Non-halide flux should be used.
Note: Non-halide flux should be used.
150 - 200 °C
217 °C
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
t 25 °C to PEAK
3 °C/SEC. MAX.
60 to 180 SEC.
smin
PREHEAT
RAMP-UP
= 150 °C
t
50
s
260 +0/-5 °C
3°C + 1°C/–0.5°C
150°C, 90 + 30 SEC.
PREHEATING TIME
TIME
2.5°C ± 0.5°C/SEC.
100
t
t
L
TIME (SECONDS)
p
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
TEMP.
PEAK
245°C
RAMP-DOWN
6 °C/SEC. MAX.
150
SEC.
SEC.
30
30
50 SEC.
SOLDERING
200°C
TIME
200
PEAK
TEMP.
240°C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
250
Regulatory Information
The HCPL-J314 has been approved
by the following organizations:
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01
UL
Approval under UL 1577, compo-
nent recognition program up to
V
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
ISO
= 3750 Vrms. File E55361.