HCPL-T251#300 Avago Technologies US Inc., HCPL-T251#300 Datasheet - Page 4

OPTOCOUPLER DRIVER 0.4A 8-SMD GW

HCPL-T251#300

Manufacturer Part Number
HCPL-T251#300
Description
OPTOCOUPLER DRIVER 0.4A 8-SMD GW
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of HCPL-T251#300

Output Type
Push-Pull, Totem-Pole
Package / Case
8-SMD Gull Wing
Voltage - Isolation
3750Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
400mA
Propagation Delay High - Low @ If
250ns @ 8mA ~ 12mA
Current - Dc Forward (if)
20mA
Input Type
DC
Mounting Type
Surface Mount, Gull Wing
Configuration
1 Channel
Isolation Voltage
3750 Vrms
Maximum Propagation Delay Time
250 ns
Maximum Forward Diode Voltage
1.8 V
Maximum Reverse Diode Voltage
5 V
Maximum Forward Diode Current
12 mA
Maximum Continuous Output Current
0.4 A
Maximum Power Dissipation
250 mW
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 20 C
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HCPL-T251#300HCPL-T251
Manufacturer:
AVAGO
Quantity:
25 000
Company:
Part Number:
HCPL-T251#300HCPL-T251
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Company:
Part Number:
HCPL-T251#300HCPL-T251-000E
Manufacturer:
AVAGO
Quantity:
25 000
Company:
Part Number:
HCPL-T251#300HCPL-T251-000E
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Company:
Part Number:
HCPL-T251#300HCPL-T251-300E
Manufacturer:
AVAGO
Quantity:
25 000
Regulatory Information
The HCPL‑T251 is under approval by the following organizations:
UL
Approval under UL 1577, Component Recognition Pro‑
gram, File E55361.
Insulation and Safety Related
Minimum External Air Gap
(Clearance)
Minimum External Tracking
(Creepage)
Minimum Internal Plastic Gap
(Internal Clearance)
Tracking Resistance
(Comparative Tracking Index)
Isolation Group
Absolute Maximum Ratings
Operating Temperature
“High” Peak Output Current
“High” Peak Output Current
Storage Temperature
Average Input Current
Peak Transient Input Current
(<1 µs Pulse Width, 300 pps)
Reverse Input Voltage
Supply Voltage
Output Voltage
Output Power Dissipation
Lead Solder Temperature 260°C for 10 sec., 1.6 mm below seating plane
Solder Reflow Temperature Profile See Package Outline Drawings section
Notes:
1. Maximum pulse width = 10 µs, maximum duty cycle = 0.2%.
2. Derate linearly above 70°C free‑air temperature at a rate of 0.3 mA/°C.
3. Derate lineraly above 70°C free‑air temperature at a rate of 4.8 mW/°C.
4
Parameter
Parameter
(Compared with HCPL‑3140)
Symbol
L(101)
L(102)
CTI
(V
I
I
OH(PEAK)
OL(PEAK)
I
Symbol
I
F(TRAN)
CC
F(AVG)
Value
≥175
0.08
V
P
T
T
V
7.1
7.4
IIIa
‑ V
O
A
O
S
R
EE
)
Units
Volts
mm
mm
mm
Units
CSA
Approval under CSA Component Acceptance Notice #5,
File CA 88324.
mW
mA
°C
°C
A
A
A
V
V
V
Conditions
Measured from input terminals to output
terminals, shortest distance through air.
Measured from input terminals to output
terminals, shortest distance path along body.
Insulation thickness between emitter and detector;
also known as distance through insulation
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
Min.
‑ 40
‑0.5
‑55
0
HCPL-3140
Max.
100
125
250
V
0.6
0.6
1.0
25
35
5
CC
Min.
‑0.5
‑20
‑55
0
HCPL-T251
Max.
125
V
250
0.4
0.4
1.0
85
20
35
5
CC
Note
1
2
3

Related parts for HCPL-T251#300