ACPL-W60L-560E Avago Technologies US Inc., ACPL-W60L-560E Datasheet - Page 4

• Manufacturer Part Number: ACPL-W60L-560E
• Description: OPTOCOUPLER 15MBD 3.3V VDE 6SOIC
• Manufacturer: Avago Technologies US Inc.

Specifications of ACPL-W60L-560E

• Package / Case: 6-SOP
• Voltage - Isolation: 3750Vrms
• Number Of Channels: 1, Unidirectional
• Current - Output / Channel: 50mA
• Data Rate: 15MBd
• Propagation Delay High - Low @ If: 75ns @ 7.5mA
• Current - Dc Forward (if): 20mA
• Input Type: DC
• Output Type: Open Collector
• Mounting Type: Surface Mount
• Isolation Voltage: 3750 Vrms
• Maximum Continuous Output Current: 50 mA
• Maximum Fall Time: 20 ns
• Maximum Forward Diode Current: 20 mA
• Maximum Rise Time: 45 ns
• Minimum Forward Diode Voltage: 1.4 V
• Output Device: Logic Gate Photo IC
• Configuration: 1 Channel
• Maximum Baud Rate: 15 MBps
• Maximum Forward Diode Voltage: 1.75 V
• Maximum Reverse Diode Voltage: 5 V
• Maximum Power Dissipation: 85 mW
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Number Of Elements: 1
• Forward Voltage: 1.75V
• Forward Current: 20mA
• Output Current: 50mA
• Operating Temp Range: -40C to 85C
• Power Dissipation: 85mW
• Propagation Delay Time: 90ns
• Pin Count: 6
• Mounting: Surface Mount
• Reverse Breakdown Voltage: 5V
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Recommended Solder Reflow Thermal Profile
Recommended PB-Free IR Profile
Regulatory Information
The ACPL-W60L/K63L have been approved by the following organizations:
UL
Approval under UL 1577, Component Recognition Program, File E55361.
CSA
Approval under CSA Component Acceptance Notice #5, File CA 88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884Teil 2):2003-01 Option 060 only)
4
TEMPERATURE
ROOM
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
T
T
smax
smax
smin
300
200
100
T
T
25
0
p
L
0
= 200 °C, T
Note: Non-halide flux should be used.
Note: Non-halide flux should be used.
150 - 200 °C
217 °C
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
t 25 °C to PEAK
3 °C/SEC. MAX.
60 to 180 SEC.
smin
PREHEAT
RAMP-UP
= 150 °C
50
t
s
3°C + 1°C/–0.5°C
260 +0/-5 °C
150°C, 90 + 30 SEC.
PREHEATING TIME
TIME
2.5°C ± 0.5°C/SEC.
100
TIME (SECONDS)
t
t
L
p
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
TEMP.
245°C
PEAK
RAMP-DOWN
6 °C/SEC. MAX.
150
SEC.
SEC.
30
30
50 SEC.
SOLDERING
200°C
TIME
200
PEAK
TEMP.
240°C
TIGHT
TYPICAL
LOOSE
TEMP.
230°C
PEAK
250