HCPL-J314#500 Avago Technologies US Inc., HCPL-J314#500 Datasheet - Page 4

OPTOCOUPLER 1CH 0.6A 8-SMD

HCPL-J314#500

Manufacturer Part Number
HCPL-J314#500
Description
OPTOCOUPLER 1CH 0.6A 8-SMD
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of HCPL-J314#500

Package / Case
8-SMD Gull Wing
Voltage - Isolation
3750Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
600mA
Propagation Delay High - Low @ If
300ns @ 8mA
Current - Dc Forward (if)
25mA
Input Type
DC
Output Type
Push-Pull, Totem-Pole
Mounting Type
Surface Mount, Gull Wing
Isolation Voltage
3750 Vrms
Maximum Fall Time
50 ns
Maximum Forward Diode Current
25 mA
Maximum Rise Time
50 ns
Minimum Forward Diode Voltage
1.2 V
Output Device
Integrated Photo IC
Configuration
1 Channel
Maximum Forward Diode Voltage
1.8 V
Maximum Reverse Diode Voltage
3 V
Maximum Power Dissipation
260 mW
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HCPL-J314#500HCPL-J314
Manufacturer:
AVAGO
Quantity:
2 100
Company:
Part Number:
HCPL-J314#500HCPL-J314
Manufacturer:
AGILENT
Quantity:
20 000
Company:
Part Number:
HCPL-J314#500HCPL-J314-000E
Manufacturer:
AVAGO
Quantity:
10 000
Company:
Part Number:
HCPL-J314#500HCPL-J314-300E
Manufacturer:
AVAGO
Quantity:
10 000
Company:
Part Number:
HCPL-J314#500HCPL-J314-300E
Manufacturer:
AVAGO/安华高
Quantity:
20 000
TEMPERATURE
ROOM
Solder Reflow Temperature Profile
Recommended Pb-Free IR Profile
4
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
T
T
smax
smax
smin
300
200
100
T
T
25
0
p
L
= 200 °C, T
0
Note: Non-halide flux should be used.
Note: Non-halide flux should be used.
150 - 200 °C
217 °C
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
t 25 °C to PEAK
3 °C/SEC. MAX.
60 to 180 SEC.
smin
PREHEAT
RAMP-UP
= 150 °C
t
50
s
260 +0/-5 °C
3°C + 1°C/–0.5°C
150°C, 90 + 30 SEC.
PREHEATING TIME
TIME
2.5°C ± 0.5°C/SEC.
100
t
t
L
TIME (SECONDS)
p
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
TEMP.
PEAK
245°C
RAMP-DOWN
6 °C/SEC. MAX.
150
SEC.
SEC.
30
30
50 SEC.
SOLDERING
200°C
TIME
200
PEAK
TEMP.
240°C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
250
Regulatory Information
The HCPL-J314 has been approved
by the following organizations:
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01
UL
Approval under UL 1577, compo-
nent recognition program up to
V
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
ISO
= 3750 Vrms. File E55361.

Related parts for HCPL-J314#500