HCPL-0710-500E Avago Technologies US Inc., HCPL-0710-500E Datasheet - Page 4

• Manufacturer Part Number: HCPL-0710-500E
• Description: OPTOCOUPLER CMOS 12MBD 8-SOIC
• Manufacturer: Avago Technologies US Inc.

Specifications of HCPL-0710-500E

• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Voltage - Isolation: 3750Vrms
• Number Of Channels: 1, Unidirectional
• Current - Output / Channel: 10mA
• Data Rate: 12.5MBd
• Propagation Delay High - Low @ If: 20ns
• Input Type: Logic
• Output Type: Push-Pull, Totem-Pole
• Mounting Type: Surface Mount
• Isolation Voltage: 3750 Vrms
• Maximum Continuous Output Current: 10 mA
• Maximum Fall Time: 0.008 us
• Maximum Forward Diode Current: 10 mA
• Output Device: Logic Gate Photo IC
• Configuration: 1 Channel
• Maximum Baud Rate: 12.5 MBd
• Maximum Power Dissipation: 150 mW
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 516-1489-2

4
Package Outline Drawing
HCPL-0710 Outline Drawing (Small Outline SO-8 Package)
Solder Reflow Thermal Profile
TEMPERATURE
*
ROOM
TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
OPTION NUMBER 500 NOT MARKED.
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
(0.155 ± 0.005)
(0.016 ± 0.003)
3.937 ± 0.127
0.406 ± 0.076
(0.125 ± 0.005)
3.175 ± 0.127
Note: Non-halide flux should be used.
300
200
100
PIN ONE
0
0
PREHEATING RATE 3°C + 1°C/- 0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
8
1
*
(0.200 ± 0.005)
5.080 ± 0.127
7
2
50
XXXV
YWW
3°C + 1°C/- 0.5°C
6
3
PREHEATING TIME
150°C, 90 + 30 SEC.
5
4
2.5°C ± 0.5°C/SEC.
(0.050)
1.270
(0.236 ± 0.008)
(0.060)
5.994 ± 0.203
1.524
100
TIME (SECONDS)
BSC
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
0 ~ 7°
TEMP.
PEAK
245°C
150
7°
(0.012)
0.305
SEC.
SEC.
30
30
LAND PATTERN RECOMMENDATION
MIN.
50 SEC.
45° X
SOLDERING
(0.008 ± 0.004)
200°C
0.203 ± 0.102
TIME
200
(0.017)
0.432
PEAK
TEMP.
240°C
0.64 (0.025)
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
(0.009 ± 0.001)
1.9 (0.075)
0.228 ± 0.025
250
7.49 (0.295)