HCPL-0721-000E Avago Technologies US Inc., HCPL-0721-000E Datasheet - Page 6
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HCPL-0721-000E
Manufacturer Part Number
HCPL-0721-000E
Description
OPTOCOUPLER CMOS 25MBD 8-SOIC
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HCPL-0720-000E.pdf
(19 pages)
Specifications of HCPL-0721-000E
Package / Case
8-SOIC (0.154", 3.90mm Width)
Voltage - Isolation
3750Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
10mA
Data Rate
25MBd
Propagation Delay High - Low @ If
20ns
Input Type
Logic
Output Type
Push-Pull, Totem-Pole
Mounting Type
Surface Mount
Isolation Voltage
3750 Vrms
Maximum Continuous Output Current
10 mA
Maximum Fall Time
0.008 us
Output Device
Logic Gate Photo IC
Configuration
1 Channel
Maximum Baud Rate
25 MBd
Maximum Power Dissipation
150 mW
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Number Of Elements
1
Baud Rate
25Mbps
Output Current
10mA
Package Type
SOIC
Operating Temp Range
-40C to 85C
Power Dissipation
150mW
Propagation Delay Time
40ns
Pin Count
8
Mounting
Surface Mount
Operating Temperature Classification
Industrial
No. Of Channels
1
Optocoupler Output Type
Gate Drive
Input Current
10µA
Output Voltage
5V
Opto Case Style
SOIC
No. Of Pins
8
Common Mode Ratio
10000
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
516-1639-5
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HCPL-0721-000E
Manufacturer:
AVAGO
Quantity:
40 000
Part Number:
HCPL-0721-000E
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Insulation and Safety Related Specifications
All Avago data sheets report the creepage and clearance
inherent to the optocoupler component itself. These
dimen sions are needed as a starting point for the equip-
ment designer when determining the circuit insulation
requirements. However, once mounted on a printed
circuit board, minimum creepage and clearance require-
ments must be met as specified for individual equipment
standards. For creepage, the shortest distance path along
6
Parameter
Minimum External Air
Gap (Clearance)
Minimum External
Tracking (Creepage)
Minimum Internal Plastic
Gap (Internal Clearance)
Tracking Resistance
(Comparative Tracking
Index)
Isolation Group
Symbol
L(I01)
L(I02)
CTI
772X
7.1
7.4
0.08
≥175
IIIa
Value
072X
4.9
4.8
0.08
≥175
IIIa
Units
mm
mm
mm
Volts
the surface of a printed circuit board between the solder
fillets of the input and output leads must be considered.
There are recommended techniques such as grooves
and ribs which may be used on a printed circuit board to
achieve desired creepage and clearances. Creepage and
clearance distances will also change depending on fac-
tors such as pollution degree and insulation level.
Conditions
Measured from input terminals to output
Measured from input terminals to output
terminals, shortest distance path along body.
Insulation thickness between emitter and
detector; also known as distance through
insulation.
DIN IEC 112/VDE 0303 Part 1
Material Group
(DIN VDE 0110, 1/89, Table 1)
terminals, shortest distance through air.