HCPL-0630-000E Avago Technologies US Inc., HCPL-0630-000E Datasheet - Page 7
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HCPL-0630-000E
Manufacturer Part Number
HCPL-0630-000E
Description
OPTOCPLR 2CH LOG-OUT 10MBD 8SOIC
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HCPL-0600-500E.pdf
(22 pages)
Specifications of HCPL-0630-000E
Package / Case
8-SOIC (0.154", 3.90mm Width)
Voltage - Isolation
3750Vrms
Number Of Channels
2, Unidirectional
Current - Output / Channel
50mA
Data Rate
10Mbps
Propagation Delay High - Low @ If
50ns @ 7.5mA
Current - Dc Forward (if)
20mA
Input Type
DC
Output Type
Open Collector
Mounting Type
Surface Mount
Isolation Voltage
3750 Vrms
Maximum Continuous Output Current
50 mA
Maximum Fall Time
0.01 us
Maximum Forward Diode Current
15 mA
Minimum Forward Diode Voltage
1.4 V
Output Device
Logic Gate Photo IC
Configuration
2 Channel
Maximum Baud Rate
10 MBd(Typ)
Maximum Forward Diode Voltage
1.75 V
Maximum Reverse Diode Voltage
5 V
Maximum Power Dissipation
60 mW
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
No. Of Channels
2
Optocoupler Output Type
Logic Gate
Input Current
15mA
Output Voltage
7V
Opto Case Style
SOIC
No. Of Pins
8
Common Mode Ratio
10000
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
516-1735-5
HCPL-0630-000E
HCPL-0630-000E
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HCPL-0630-000E
Manufacturer:
Avago Technologies
Quantity:
1 954
Solder Reflow Temperature Profile
7
8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300
(HCNW137, HCNW2601/11)
TEMPERATURE
ROOM
(0.071 ± 0.006)
1.80 ± 0.15
300
200
100
0
0
NOTE: NON-HALIDE FLUX SHOULD BE USED.
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC.
REFLOW HEATING RATE 2.5 °C ± 0.5 °C/SEC.
160 °C
150 °C
140 °C
1
8
(0.442 ± 0.006)
11.23 ± 0.15
7
2
(0.100)
3
6
BSC
2.54
50
3 °C + 1 °C/–0.5 °C
4
5
(0.061)
MAX.
1.55
150 °C, 90 + 30 SEC.
PREHEATING TIME
(0.354 ± 0.006)
(0.158)
9.00 ± 0.15
4.00
MAX.
(0.030 ± 0.010)
2.5 C ± 0.5 °C/SEC.
0.75 ± 0.25
100
TIME (SECONDS)
LAND PATTERN RECOMMENDATION
245 °C
TEMP.
PEAK
(0.051)
1.3
(0.039 ± 0.006)
(0.484 ± 0.012)
1.00 ± 0.15
12.30 ± 0.30
(0.433)
150
11.00
MAX.
SEC.
30
SEC.
30
(0.09)
2.29
50 SEC.
7° NOM.
SOLDERING
200 °C
TIME
200
(0.534)
13.56
(0.010
0.254
PEAK
TEMP.
240 °C
- 0.0051
+ 0.003)
- 0.002)
+ 0.076
TIGHT
TYPICAL
LOOSE
230 °C
TEMP.
PEAK
250