NBSG16VSMN ON Semiconductor, NBSG16VSMN Datasheet - Page 13
![IC RCVR/DRIVER SIGE DIFF 16QFN](/photos/38/74/387474/qfn-16_sml.jpg)
NBSG16VSMN
Manufacturer Part Number
NBSG16VSMN
Description
IC RCVR/DRIVER SIGE DIFF 16QFN
Manufacturer
ON Semiconductor
Type
Transceiverr
Datasheet
1.NBSG16VSMNR2G.pdf
(14 pages)
Specifications of NBSG16VSMN
Applications
Instrumentation
Mounting Type
Surface Mount
Package / Case
16-TFQFN Exposed Pad
Logic Family
NBSG
Logic Type
Differential Receiver and Driver
Supply Voltage (max)
- 3.465 V, 3.465 V
Supply Voltage (min)
- 2.375 V, 2.375 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Number Of Lines (input / Output)
/ /
Supply Current
32 mA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
NBSG16VSMNOS
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NBSG16VSMN
Manufacturer:
ON/安森美
Quantity:
20 000
LASER MARK FOR PIN 1
IDENTIFICATION IN
THIS AREA
−Y−
3 X
E
A
e
0.20
S
A2
−X−
ROTATED 90 CLOCKWISE
A1
VIEW M−M
4
DETAIL K
3
D
_
4
2
PLASTIC 4X4 (mm) BGA FLIP CHIP PACKAGE
1
A
B
C
D
0.10 Z
FEDUCIAL FOR PIN A1
IDENTIFICATION IN THIS AREA
16 X
16 X
PACKAGE DIMENSIONS
3
5
0.15 Z
b
http://onsemi.com
0.15
0.08
−Z−
CASE 489−01
BA SUFFIX
FCBGA−16
M
M
ISSUE O
K
Z
Z
13
X
M
M
Y
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
3. DIMENSION b IS MEASURED AT THE MAXIMUM
4. DATUM Z (SEATING PLANE) IS DEFINED BY THE
5. PARALLELISM MEASUREMENT SHALL EXCLUDE
PER ASME Y14.5M, 1994.
SOLDER BALL DIAMETER, PARALLEL TO DATUM
PLANE Z.
SPHERICAL CROWNS OF THE SOLDER BALLS.
ANY EFFECT OF MARK ON TOP SURFACE OF
PACKAGE.
DIM
A1
A2
A
b
D
E
e
S
MILLIMETERS
MIN
0.25
0.30
1.40 MAX
1.20 REF
4.00 BSC
4.00 BSC
1.00 BSC
0.50 BSC
MAX
0.35
0.50