MC33780EG Freescale Semiconductor, MC33780EG Datasheet - Page 4

• Manufacturer Part Number: MC33780EG
• Description: IC DBUS MASTER DUAL DIFF 16-SOIC
• Manufacturer: Freescale Semiconductor

Specifications of MC33780EG

• Applications: *
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.300", 7.5mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Table 2. Maximum Ratings
permanent damage to the device.
4
33780
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL RATINGS
THERMAL RATINGS
Notes
Supply Voltages
Maximum Voltage on Logic Input /Output Pins
Maximum Voltage on DBUS Pins
Maximum DBUS Pin Current
Maximum Logic Pin Current
ESD Voltage
Storage Temperature
Operating Ambient Temperature
Operating Junction Temperature
Thermal Shutdown
Resistance, Junction-to-Ambient
Resistance, Junction-to-Board
Peak Package Reflow Temperature During Reflow
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
1.
2.
3.
V
Load Dump V
V
Human Body Model (HBM)
Machine Model (MM)
Charge Device Model (CDM)
SUP
CC
ESD1 testing is performed in accordance with the Human Body Model (HBM) (C
performed in accordance with the Machine Model (MM) (C
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
1
SUP
(300 ms maximum)
Ratings
ELECTRICAL CHARACTERISTICS
(2)
,
(3)
MAXIMUM RATINGS
ZAP
= 200 pF, R
ZAP
Symbol
= 0 Ω); and Charge Body Model (CBM).
V
V
I
T
I
V
V
ZAP
LOGIC
T
R
R
SUPLD
DBUS
V
T
DBUS
PPRT
T
SUP
ESD
STG
T
Θ
Θ
CC
–
SD
A
J
JA
JB
= 100 pF, R
Analog Integrated Circuit Device Data
±750 for corner pins
-0.3 to V
ZAP
-0.3 to V
±500 for others
-0.3 to 26.5
155 to 190
-0.3 to 7.0
-55 to 150
-40 to 150
-40 to 85
= 1500 Ω); ESD2 testing is
±2000
Value
Note 3
±200
400
109
40
20
50
SUP
CC
Freescale Semiconductor
+ 0.3
+ 0.3
°C/W
°C/W
Unit
mA
mA
°C
°C
°C
°C
°C
V
V
V
V