B32676E6146K EPCOS Inc, B32676E6146K Datasheet - Page 12
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B32676E6146K
Manufacturer Part Number
B32676E6146K
Description
CAP 14UF 10% 630V METAL POLYPRO
Manufacturer
EPCOS Inc
Series
MKP B32676r
Datasheet
1.B32674D8474K.pdf
(32 pages)
Specifications of B32676E6146K
Capacitance
14µF
Tolerance
±10%
Lead Spacing
1.476" (37.50mm)
Voltage - Ac
350V
Voltage - Dc
630V
Dielectric Material
Polypropylene, Metallized
Operating Temperature
-40°C ~ 105°C
Mounting Type
Through Hole
Package / Case
Radial
Size / Dimension
1.654" L x 1.181" W (42.00mm x 30.00mm)
Height
1.772" (45.00mm)
Termination
PC Pins
Features
AC and Pulse
Voltage Rating
630 Volts
Esr
3.7 mOhms
Termination Style
Radial
Dimensions
30 mm W x 42 mm L x 45 mm H
Operating Temperature Range
- 55 C to + 85 C
Product
Metallized Polypropylene Capacitors
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Esr (equivalent Series Resistance)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
495-2977
B32676E6146K000
B32676E6146K000
Mounting guidelines
1
1.1
The solderability of terminal leads is tested to IEC 60068-2-20, test Ta, method 1.
Before a solderability test is carried out, terminals are subjected to accelerated ageing (to
IEC 60068-2-2, test Ba: 4 h exposure to dry heat at 155 C). Since the ageing temperature is far
higher than the upper category temperature of the capacitors, the terminal wires should be cut off
from the capacitor before the ageing procedure to prevent the solderability being impaired by the
products of any capacitor decomposition that might occur.
Solder bath temperature
Soldering time
Immersion depth
Evaluation criteria:
Visual inspection
1.2
Resistance to soldering heat is tested to IEC 60068-2-20, test Tb, method 1A.
Conditions:
Series
MKT boxed (except 2.5
MFP
MKP (lead spacing > 7.5 mm)
MKT boxed (case 2.5
MKP
MKT
Please read Cautions and warnings and
Important notes at the end of this document.
coated
uncoated (lead spacing > 10 mm)
(lead spacing
uncoated (lead spacing
insulated (B32559)
Soldering
Solderability of leads
Resistance to soldering heat
B32674 ... B32678
MKP DC link
7.5 mm)
6.5
6.5
7.2 mm)
high power series
235 5 C
2.0 0.5 s
2.0 +0/ 0.5 mm from capacitor body or seating plane
Wetting of wire surface by new solder 90%, free-flowing solder
10 mm)
7.2 mm)
Solder bath temperature Soldering time
260 5 C
Page 12 of 32
10 1 s
5 1 s
< 4 s
recommended soldering
profile for MKT uncoated
(lead spacing
insulated (B32559)
10 mm) and