LT1936EMS8E#TRPBF Linear Technology, LT1936EMS8E#TRPBF Datasheet - Page 14
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LT1936EMS8E#TRPBF
Manufacturer Part Number
LT1936EMS8E#TRPBF
Description
IC REG SW 1.4A 8-MSOP
Manufacturer
Linear Technology
Type
Step-Down (Buck)r
Datasheet
1.LT1936EMS8ETRPBF.pdf
(20 pages)
Specifications of LT1936EMS8E#TRPBF
Internal Switch(s)
Yes
Synchronous Rectifier
No
Number Of Outputs
1
Voltage - Output
1.2 ~ 31.3 V
Current - Output
1.4A
Frequency - Switching
500kHz
Voltage - Input
3.6 ~ 36 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-MSOP Exposed Pad, 8-HMSOP, 8-eMSOP
Dc To Dc Converter Type
Step Down
Pin Count
8
Input Voltage
36V
Output Voltage
1.2 to 31.32V
Switching Freq
600kHz
Output Current
2.6A
Package Type
MSOP EP
Output Type
Adjustable
Switching Regulator
Yes
Line Regulation
0.01%/V
Mounting
Surface Mount
Input Voltage (min)
3.6V
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power - Output
-
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
APPLICATIONS INFORMATION
LT1936
the SHDN pin, the SW pin current will drop to essentially
zero. However, if the V
is held high, then parasitic diodes inside the LT1936 can
pull large currents from the output through the SW pin
and the V
when the input voltage is present and that protects against
a shorted or reversed input.
PCB Layout
For proper operation and minimum EMI, care must be
taken during printed circuit board layout. Figure 7 shows
the recommended component placement with trace,
ground plane and via locations. Note that large, switched
currents fl ow in the LT1936’s V
diode (D1) and the input capacitor (C2). The loop formed
by these components should be as small as possible. These
components, along with the inductor and output capacitor,
should be placed on the same side of the circuit board,
and their connections should be made on that layer. Place
a local, unbroken ground plane below these components.
The SW and BOOST nodes should be as small as possible.
Finally, keep the FB and V
traces will shield them from the SW and BOOST nodes.
The Exposed Pad on the bottom of the package must be
soldered to ground so that the pad acts as a heat sink. To
keep thermal resistance low, extend the ground plane as
much as possible, and add thermal vias under and near
the LT1936 to additional ground planes within the circuit
board and on the bottom side.
14
Figure 6. Diode D4 Prevents a Shorted Input from Discharging
a Backup Battery Tied to the Output; It Also Protects the Circuit
from a Reversed Input. The LT1936 Runs Only When the Input
is Present
V
IN
MBRS140
D4
IN
pin. Figure 6 shows a circuit that will run only
V
SHDN
V
COMP GND FB
IN
C
LT1936
IN
BOOST
pin is grounded while the output
C
SW
nodes small so that the ground
IN
and SW pins, the catch
1936 F06
V
BACKUP
OUT
High Temperature Considerations
The die temperature of the LT1936 must be lower than the
maximum rating of 125°C (150°C for the H grade). This is
generally not a concern unless the ambient temperature
is above 85°C. For higher temperatures, care should be
taken in the layout of the circuit to ensure good heat sink-
ing of the LT1936. The maximum load current should be
derated as the ambient temperature approaches 125°C
(150°C for the H grade).
The die temperature is calculated by multiplying the LT1936
power dissipation by the thermal resistance from junction
to ambient. Power dissipation within the LT1936 can be
estimated by calculating the total power loss from an
effi ciency measurement and subtracting the catch diode
loss. The resulting temperature rise at full load is nearly
independent of input voltage. Thermal resistance depends
on the layout of the circuit board, but values from 40°C/W
to 60°C/W are typical.
Die temperature rise was measured on a 4-layer, 5cm
6.5cm circuit board in still air at a load current of 1.4A.
For 12V input to 3.3V output the die temperature elevation
above ambient was 26°C; for 24V in to 3.3V out the rise
was 31°C; for 12V in to 5V the rise was 31°C and for 24V
in to 5V the rise was 34°C.
Figure 7. A Good PCB Layout Ensures Low EMI Operation
C2, D1 LOOP
MINIMIZE
VIAS
LT1936
D2
OUT
C3
L1
IN
D1
C2
C1
GND
GND
1936 F07
R2
R1
R4
1936fd
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