LT1767EMS8-1.8#TRPBF Linear Technology, LT1767EMS8-1.8#TRPBF Datasheet - Page 12
![IC SW REG STEP-DOWN 1.8V 8-MSOP](/photos/7/63/76301/lt1767ems8_pbf_sml.jpg)
LT1767EMS8-1.8#TRPBF
Manufacturer Part Number
LT1767EMS8-1.8#TRPBF
Description
IC SW REG STEP-DOWN 1.8V 8-MSOP
Manufacturer
Linear Technology
Type
Step-Down (Buck)r
Datasheet
1.LT1767EMS8-3.3PBF.pdf
(16 pages)
Specifications of LT1767EMS8-1.8#TRPBF
Internal Switch(s)
Yes
Synchronous Rectifier
No
Number Of Outputs
1
Voltage - Output
1.8V
Current - Output
1.5A
Frequency - Switching
1.25MHz
Voltage - Input
3 ~ 25 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power - Output
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LT1767EMS8-1.8#TRPBFLT1767EMS8-1.8#PBF
Manufacturer:
LINEAR/凌特
Quantity:
20 000
Part Number:
LT1767EMS8-1.8#TRPBFLT1767EMS8-1.8#TR
Manufacturer:
LINEAR/凌特
Quantity:
20 000
LT1767/LT1767-1.8/
LT1767-2.5/LT1767-3.3/LT1767-5
APPLICATIONS
Total power dissipation is 0.34 + 0.05 + 0.01 = 0.4W.
Thermal resistance for LT1767 package is influenced by
the presence of internal or backside planes. With a full
plane under the package, thermal resistance for the
exposed pad package will be about 40 C/W. No plane will
increase resistance to about 150 C/W. To calculate die
temperature, use the appropriate thermal resistance
number and add in worst-case ambient temperature:
12
T
J
= T
A
+
JA
(P
TOT
MINIMIZE LT1767,
U
)
C3, D1 LOOP
INFORMATION
U
Figure 6. Typical Application and Suggested Layout (Topside Only Shown)
12V
V
CERAMIC
IN
2.2 F
W
L1
C3
C2
OPEN
HIGH
= ON
OR
CMDSH-3
U
V
D2
D2
IN
V
SHDN
SYNC
IN
V
OUT
LT1767-2.5
BOOST
GND
C1
C3
V
C
V
R
4.7k
GND
SW
D1
FB
KELVIN SENSE
V
When estimating ambient, remember the nearby catch
diode and inductor will also be dissipating power.
C
C
1.5nF
OUT
C
0.1 F
V
P
P
C2
DIODE
DIODE
F
= Forward voltage of diode (assume 0.5V at 1A)
D1
UPS120
CONNECT TO
GROUND PLANE
5 H
L1
V V
0 5 12 5 1
F
.
GND
1767 F06a
C1
10 F
CERAMIC
IN
12
OUTPUT
2.5V
1.2A
SHDN
SYNC
1767 F06
PLACE FEEDTHROUGHS
AROUND GROUND PIN
AND UNDER GROUND PAD
FOR GOOD THERMAL
CONDUCTIVITY
R
C
C
C
V
V
IN
OUT
KEEP FB AND V
COMPONENTS
AWAY FROM
HIGH INPUT
COMPONENTS
I
LOAD
0 29
.
W
C
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