MCP1603-330I/MC Microchip Technology, MCP1603-330I/MC Datasheet - Page 20

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MCP1603-330I/MC

Manufacturer Part Number
MCP1603-330I/MC
Description
IC SYNC BUCK REG 0.5A 3.3V 8DFN
Manufacturer
Microchip Technology
Type
Step-Down (Buck)r
Datasheet

Specifications of MCP1603-330I/MC

Internal Switch(s)
Yes
Synchronous Rectifier
Yes
Number Of Outputs
1
Voltage - Output
3.3V
Current - Output
500mA
Frequency - Switching
2MHz
Voltage - Input
2.7 ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-DFN
For Use With
MCP1603RD-TNY - REFERENCE DESIGN FOR MCP1603MCP1603EV - BOARD EVAL BUCK CONV MCP1603
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power - Output
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
MCP1603
DS22042A-page 20
5-Lead Plastic Thin Small Outline Transistor (OS) [TSOT]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Leads
Lead Pitch
Outside Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
NOTE 1
A1
A
1
N
2
e1
D
e
3
b
Dimension Limits
E1
A2
E
Units
A2
A1
E1
e1
L1
N
A
E
D
α
e
L
φ
c
b
β
c
0.70
0.00
0.30
0.08
0.30
MIN
β
MILLIMETERS
0.95 BSC
1.90 BSC
2.80 BSC
1.60 BSC
2.90 BSC
0.60 REF
NOM
0.90
0.45
10°
10°
Microchip Technology Drawing C04-128B
5
© 2007 Microchip Technology Inc.
L1
L
α
MAX
1.10
1.00
0.10
0.60
0.20
0.50
12°
12°
φ

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