MAX5073ETI+ Maxim Integrated Products, MAX5073ETI+ Datasheet - Page 23

• Manufacturer Part Number: MAX5073ETI+
• Description: IC CONV BUCK/BOOST 28-TQFN
• Manufacturer: Maxim Integrated Products
• Type: Step-Down (Buck), Step-Up (Boost)r

Specifications of MAX5073ETI+

• Internal Switch(s): Yes
• Synchronous Rectifier: No
• Number Of Outputs: 2
• Voltage - Output: 0.8 ~ 28 V
• Current - Output: 1A, 2A
• Frequency - Switching: 200kHz ~ 2.2MHz
• Voltage - Input: 4.5 ~ 23 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 28-TQFN Exposed Pad
• Power - Output: 2.76W
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

*EP = Exposed pad.
+Denotes lead-free package.
1) Place the power components first, with ground ter-
2) Group the gate-drive components (bootstrap
3) Make the DC-DC controller ground connections as
MAX5073ATI
M AX5073ATI+ -40°C to +125°C
Ordering Information (continued)
PART
minals adjacent (inductor, C
all these connections on the top layer with wide,
copper-filled areas (2oz copper recommended).
diodes and capacitors, and VL bypass capacitor)
together near the controller IC.
follows:
2.2MHz, Dual-Output Buck or Boost Converter
-40°C to +125°C
TEMP RANGE
______________________________________________________________________________________
PIN-PACKAGE
28 Thin QFN-EP*
(5mm x 5mm)
28 Thin QFN-EP*
(5mm x 5mm)
IN_
Layout Procedure
, and C
OUT_
with Internal Power MOSFETs
T2855-6
T2855-6
). Make
CODE
PKG
TRANSISTOR COUNT: 5994
PROCESS: BiCMOS
a) Create a small-signal ground plane underneath
b) Connect this plane to SGND and use this plane
c) Connect SGND and PGND together near the
the IC.
for the ground connection for the reference
(BYPASS), enable, compensation components,
feedback dividers, and OSC resistor.
input bypass capacitors and the IC (this is the
only connection between SGND and PGND).
Chip Information
23