LM3676SD-ADJ/NOPB National Semiconductor, LM3676SD-ADJ/NOPB Datasheet - Page 4
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LM3676SD-ADJ/NOPB
Manufacturer Part Number
LM3676SD-ADJ/NOPB
Description
IC CONV DC-DC 600MA ADJ 8-LLP
Manufacturer
National Semiconductor
Type
Step-Down (Buck)r
Datasheet
1.LM3676SD-3.3NOPB.pdf
(20 pages)
Specifications of LM3676SD-ADJ/NOPB
Internal Switch(s)
Yes
Synchronous Rectifier
No
Number Of Outputs
1
Voltage - Output
1.1 ~ 3.3 V
Current - Output
600mA
Frequency - Switching
2MHz
Voltage - Input
2.9 ~ 5.5 V
Operating Temperature
-30°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-LLP
Power - Output
1.78W
For Use With
LM3676SD-ADJEV - BOARD EVALUATION LM3676SD-ADJ
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
LM3676SD-ADJTR
www.national.com
V
V
I
I
R
R
I
V
V
I
I
F
SHDN
Q
LIM
EN
Mode
OSC
FB
REF
IH
IL
DSON (P)
DSON (N)
Absolute Maximum Ratings
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Electrical Characteristics
apply over the full operating junction temperature range (−30°C
the LM3676SD with V
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of
the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see
the Electrical Characteristics tables.
Note 2: All voltages are with respect to the potential at the GND pin.
Note 3: Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T
T
Note 4: The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF capacitor discharged
directly into each pin. MIL-STD-883 3015.7
Note 5: In Applications where high power dissipation and/or poor package resistance is present, the maximum ambient temperature may have to be derated.
Maximum ambient temperature (T
the application (P
− (θ
Note 6: Junction to ambient thermal resistance is highly application and board layout dependent. In applications where high power dissipation exists, special care
must be given to thermal dissipation issues in board design. Specified value of 130 °C/W for LLP is based on a 4 layer, 4" x 3", 2/1/1/2 oz. Cu board as per JEDEC
standards is used.
Note 7: Refer to datasheet curves for closed loop data and its variation with regards to supply voltage and temperature. Electrical Characteristic table reflects
open loop data (FB=0V and current drawn from SW pin ramped up until cycle by cycle current limit is activated). Closed loop current limit is the peak inductor
current measured in the application circuit by increasing output current until output voltage drops by 10%.
Note 8: Min and Max limits are guaranteed by design, test or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm.
Note 9: The parameters in the electrical characteristic table are tested at V
refer to datasheet curves.
V
FB, SW, EN, Mode Pin:
Continuous Power Dissipation
(Note 3)
Junction Temperature (T
Storage Temperature Range
Maximum Lead Temperature
ESD Rating (Note 4)
Symbol
J
= 130°C (typ.).
IN
(Soldering, 10 sec.)
JA
Pin: Voltage to GND
x P
D-MAX
). Refer to Dissipation rating table for P
Feedback Voltage (Fixed / Adj) (Note 11)
Line Regulation
Load Regulation
Internal Reference Voltage
Shutdown Supply Current
DC Bias Current into V
Pin-Pin Resistance for PFET
Pin-Pin Resistance for NFET
Switch Peak Current Limit (Note 7)
Logic High Input for EN and Mode Pin
Logic Low Input for EN and Mode Pin
Enable (EN) Input Current
Mode Pin Input Current
Internal Oscillator Frequency
D-MAX
) and the junction to ambient thermal resistance of the package (θ
IN
= 3.6V
J-MAX
A-MAX
Parameter
)
) is dependent on the maximum operating junction temperature (T
IN
Internally Limited
−65°C to +150°C
D-MAX
(Notes 2, 8, 9)
(GND−0.2V) to
−0.2V to 6.0V
(Note 1)
(V
values at different ambient temperatures.
IN
+125°C
+ 0.2V)
260°C
2.9V
I
100 mA
V
EN = 0V
No load, device is not switching
(FB forced higher than
programmed output voltage)
Open Loop
PWM Mode
O
IN
IN
Limits in standard typeface are for T
= 10 mA
= 3.6V
= 3.6V unless otherwise specified. For performance over the input voltage range
4
≤
≤
T
V
≤
J
IN
Operating Ratings
Thermal Properties
Input Voltage Range
Recommended Load Current
Junction Temperature (T
Ambient Temperature (T
5)
Junction-to-Ambient Thermal
Resistance (θ
board (Note 6)
Condition
≤
I
≤
O
Human Body Model
Machine Model
+125°C). Unless otherwise noted, specifications apply to
JA
≤
5.5V
) in the application, as given by the following equation:T
600 mA
JA
) for 4 layer
J-MAX
), the maximum power dissipation of the device in
Min
A
830
J
1.0
1.6
-4
) Range
) Range (Note
J
= 25°C. Limits in boldface type
J
= 150°C (typ.) and disengages at
(Notes 1, 2)
0.0013
0.031
1020
0.01
0.01
0.01
Typ
380
250
0.5
16
2
−30°C to +125°C
−30°C to +85°C
0mA to 600 mA
1200
Max
500
400
0.4
2.6
+4
35
2.9V to 5.5V
2
1
1
A-MAX
56°C/W
= T
200V
%/mA
2 kV
Units
MHz
%/V
mΩ
mΩ
J-MAX
mA
µA
µA
µA
µA
%
V
V
V