LM2750LD-5.0/NOPB National Semiconductor, LM2750LD-5.0/NOPB Datasheet - Page 12

• Manufacturer Part Number: LM2750LD-5.0/NOPB
• Description: IC CONV REG SW CAP 5V 10LLP
• Manufacturer: National Semiconductor
• Type: Step-Up (Boost), Switched Capacitor (Charge Pump), Doublerr

Specifications of LM2750LD-5.0/NOPB

• Internal Switch(s): Yes
• Synchronous Rectifier: No
• Number Of Outputs: 1
• Voltage - Output: 5V
• Current - Output: 120mA
• Frequency - Switching: 1.7MHz
• Voltage - Input: 2.7 ~ 5.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 10-LLP
• For Use With: LM2750LD-ADJEV - BOARD EVAL LM2750LD-ADJ
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power - Output: -
• Other names: LM2750LD-5.0; LM2750LD-5.0/NOPB; LM2750LD-5.0TR; Q2753617

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Application Information
LAYOUT RECOMMENDATIONS
A good board layout of the LM2750 circuit is required to
achieve optimal assembly, electical, and thermal dissipation
perfromance. Figure 4 is an example of a board layout
FIGURE 3. LM2750 Model for Power Efficiency and
Power Dissipation Calculations
FIGURE 4. LM2750-5.0 Recommended Layout
(Continued)
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implementing recommended techniques. For more informa-
tion related to layout for the LLP package, refer to National
Semiconductor’s Application Note 1187: Leadless Lead-
frame Package (LLP). Below are some general guidelines
for board layout:
• Place capacitors as close to the as possible to the
• Connect the ground pins of the LM2750 and the capaci-
• For optimal thermal performance, make the ground
LM2750, and on the same side of the board. V
V
the LM2750 pads directly to these capacitor pads.
tors to a good ground plane. The ground plane is essen-
tial for both electrical and thermal disspation perfor-
mance.
plane(s) as large as possible. Connect the die-attach pad
(DAP) of the LM2750 to the ground plane(s) with wide
traces and/or multiple vias. Top-layer ground planes are
most effective in increasing the thermal dissipation capa-
bility of the LLP package. Large internal ground planes
are also very effective in keeping the die temperature of
the LM2750 within operating ratings.
OUT
connections are most critical: run short traces from
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IN
and