LT3430IFE#PBF Linear Technology, LT3430IFE#PBF Datasheet - Page 27

IC REG SW STDN 3A 200KHZ 16TSSOP

LT3430IFE#PBF

Manufacturer Part Number
LT3430IFE#PBF
Description
IC REG SW STDN 3A 200KHZ 16TSSOP
Manufacturer
Linear Technology
Type
Step-Down (Buck)r
Datasheet

Specifications of LT3430IFE#PBF

Internal Switch(s)
Yes
Synchronous Rectifier
No
Number Of Outputs
1
Voltage - Output
1.2 ~ 54 V
Current - Output
3A
Frequency - Switching
200kHz
Voltage - Input
5.5 ~ 60 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
16-TSSOP Exposed Pad, 16-eTSSOP, 16-HTSSOP
Dc To Dc Converter Type
Step Down
Pin Count
16
Input Voltage
60V
Output Voltage
1.2 to 54V
Switching Freq
216kHz
Output Current
6.5A
Package Type
TSSOP EP
Output Type
Adjustable
Switching Regulator
Yes
Line Regulation
0.15%/V
Mounting
Surface Mount
Input Voltage (min)
5.5V
Operating Temperature Classification
Automotive
Primary Input Voltage
60V
No. Of Outputs
1
No. Of Pins
16
Operating Temperature Range
-40°C To +125°C
Msl
MSL 1 - Unlimited
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS compliant by exemption
Power - Output
-
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LT3430IFE#PBFLT3430IFE
Manufacturer:
LT/凌特
Quantity:
20 000
Company:
Part Number:
LT3430IFE#PBF
Manufacturer:
LT
Quantity:
1 030
Company:
Part Number:
LT3430IFE#PBFLT3430IFE#TRPB
Manufacturer:
LT
Quantity:
20 000
Company:
Part Number:
LT3430IFE#PBFLT3430IFE#TRPBF
Manufacturer:
LINEAR
Quantity:
2 834
Company:
Part Number:
LT3430IFE#PBFLT3430IFE-1
Manufacturer:
LINEAR/凌特
Quantity:
20 000
PACKAGE DESCRIPTION
6.60 ±0.10
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
(.0035 – .0079)
0.09 – 0.20
4.50 ±0.10
RECOMMENDED SOLDER PAD LAYOUT
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
(.169 – .177)
SEE NOTE 4
4.30 – 4.50*
(.020 – .030)
(.141)
0.50 – 0.75
MILLIMETERS
3.58
0.65 BSC
(INCHES)
0.45 ±0.05
(.116)
16-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
2.94
1.05 ±0.10
Exposed Pad Variation BB
0.25
REF
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
4. RECOMMENDED MINIMUM PCB METAL SIZE
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
FOR EXPOSED PAD ATTACHMENT
0° – 8°
FE Package
(.0256)
0.65
BSC
16 1514 13 12 11
1
(.0077 – .0118)
0.195 – 0.30
2
TYP
(.193 – .201)
3 4 5 6 7 8
4.90 – 5.10*
(.141)
3.58
10
LT3430/LT3430-1
9
(.002 – .006)
0.05 – 0.15
FE16 (BB) TSSOP 0204
(.0433)
(.116)
2.94
MAX
1.10
(.252)
6.40
BSC
27
34301fa

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