LTC3735EUHF#PBF Linear Technology, LTC3735EUHF#PBF Datasheet - Page 31
LTC3735EUHF#PBF
Manufacturer Part Number
LTC3735EUHF#PBF
Description
IC CTRLR DC/DC 2PH HI EFF 38-QFN
Manufacturer
Linear Technology
Datasheet
1.LTC3735EG.pdf
(32 pages)
Specifications of LTC3735EUHF#PBF
Applications
Controller, Intel Mobile CPU
Number Of Outputs
1
Voltage - Output
0.7 ~ 1.71 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
38-QFN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Voltage - Input
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
PACKAGE DESCRIPTIO
7.00 ± 0.10
0.75 ± 0.05
(2 SIDES)
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
5.50 ± 0.05
OUTLINE M0-220 VARIATION WHKD
(2 SIDES)
4.10 ± 0.05
(2 SIDES)
PIN 1
TOP MARK
(SEE NOTE 6)
3.20 ± 0.05
(2 SIDES)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
5.00 ± 0.10
(2 SIDES)
U
38-Lead Plastic QFN (5mm × 7mm)
(Reference LTC DWG # 05-08-1701)
RECOMMENDED SOLDER PAD LAYOUT
5.20 ± 0.05 (2 SIDES)
6.10 ± 0.05 (2 SIDES)
7.50 ± 0.05 (2 SIDES)
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
0.200 REF
UHF Package
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
0.50 BSC
0.25 ± 0.05
0.00 – 0.05
0.75 ± 0.05
5.15 ± 0.10
(2 SIDES)
0.00 – 0.05
0.200 REF
0.50 BSC
0.25 ± 0.05
BOTTOM VIEW—EXPOSED PAD
0.70 ± 0.05
PACKAGE
OUTLINE
3.15 ± 0.10
(2 SIDES)
R = 0.115
TYP
37
38
LTC3735
0.40 ± 0.10
1
2
0.435
(UH) QFN 0303
0.18
31
0.23
0.18
3735f