NCP1396BDR2G ON Semiconductor, NCP1396BDR2G Datasheet

NCP1396BDR2G

Manufacturer Part Number

NCP1396BDR2G

Description

IC CTRLR OVP HV 16SOIC

Manufacturer

ON Semiconductor

Type

High Performance Resonant Mode Controllersr

Datasheet

1.NCP1396BDR2G.pdf (25 pages)

Specifications of NCP1396BDR2G

Pwm Type

Voltage Mode

Number Of Outputs

Frequency - Max

575kHz

Duty Cycle

52%

Voltage - Supply

10.5 V ~ 20 V

Buck

Boost

Flyback

Inverting

Doubler

Divider

Cuk

Isolated

Yes

Operating Temperature

-40°C ~ 125°C

Package / Case

16-SOIC (3.9mm Width, 15 Leads)

Frequency-max

575kHz

Output Voltage Range

20 V

Output Current

300 uA

Power Dissipation

42 mW

Operating Temperature Range

- 40 C to + 125 C

Mounting Style

SMD/SMT

Input Voltage

12V

Frequency

500kHz

Supply Voltage Range

20V

Digital Ic Case Style

SOIC

No. Of Pins

Svhc

No SVHC (15-Dec-2010)

Base Number

1396

Rohs Compliant

Yes

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other names

NCP1396BDR2GOS
NCP1396BDR2GOS
NCP1396BDR2GOSTR

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

NCP1396BDR2G

Manufacturer:

ON Semiconductor

Quantity:

313

Company:

Amily Shenzhen XNWY Technology Co., Ltd

Part Number:

NCP1396BDR2G

Current page: 1 of 2
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SUBJECT: ON Semiconductor Update Notification # UN16099

TITLE: Update Notification to Product Bulletin 16059 announcing Package Pin Removal for

NCP1396

PROPOSED FIRST SHIP DATE: 11 Feb 2008

AFFECTED PRODUCT DIVISION(S): Analog IC

FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION:

Contact your local ON Semiconductor Sales Office or Scott Brow <Scott.Brow@onsemi.com>

NOTIFICATION TYPE:

ON Semiconductor will consider this change approved unless specific conditions of acceptance are

provided in writing within 30 days of receipt of this notice. To do so, contact your local ON

Semiconductor Sales Office.

DESCRIPTION AND PURPOSE:

This serves as an Update Notification to customers who received Product Bulletin PB16059

which announced a package pin removal for the NCP1396..

Due to supply issues on the lead frame change described in PB 16059, ON Semiconductor

was unable to convert the line and meet the proposed first ship date of October 23, 2007 as

listed. At this time, the line is now ready to convert; and all product shipped marked with a

date code of 806 (WW06 2008) or newer, will be produced with the updated lead frame.

For assistance, please contact;

Product Engineer:

Phone:

Email:

Product Marketing:

Phone:

Email:

Issue Date: 11 Feb 2008

Scott Brow

602-244-3288

Scott.Brow@onsemi.com

Christophe Warin

602-244-6154

Christophe.Warin@onsemi.com

UPDATE CHANGE NOTIFICATION

Generic Copy

Rev.07-02-06

11 Feb 2008

Page 1 of 2

Related parts for NCP1396BDR2G

NCP1396BDR2G Summary of contents

Page 1

... This serves as an Update Notification to customers who received Product Bulletin PB16059 which announced a package pin removal for the NCP1396.. Due to supply issues on the lead frame change described in PB 16059, ON Semiconductor was unable to convert the line and meet the proposed first ship date of October 23, 2007 as listed. At this time, the line is now ready to convert ...

Page 2

... Update Notification #16099 AFFECTED DEVICE LIST PART NCP1396ADR2G NCP1396BDR2G Issue Date: 11 Feb 2008 Rev.07-02-06 Page ...

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