ADP1882ARMZ-1.0-R7 Analog Devices Inc, ADP1882ARMZ-1.0-R7 Datasheet - Page 5

• Manufacturer Part Number: ADP1882ARMZ-1.0-R7
• Description: IC PWM BUCK CURRENT MODE 10MSOP
• Manufacturer: Analog Devices Inc

Specifications of ADP1882ARMZ-1.0-R7

• Package / Case: 10-MSOP, Micro10™, 10-uMAX, 10-uSOP
• Voltage - Supply: 2.75 V ~ 20 V
• Frequency-max: 1MHz
• Operating Temperature: -40°C ~ 125°C
• Number Of Outputs: 1
• Duty Cycle: 45%
• Pwm Type: Current Mode
• Buck: Yes
• Boost: No
• Flyback: No
• Inverting: No
• Doubler: No
• Divider: No
• Cuk: No
• Isolated: No
• Primary Input Voltage: 13V
• No. Of Outputs: 1
• Output Current: 25A
• No. Of Pins: 10
• Operating Temperature Range: -40°C To +125°C
• Msl: MSL 3 - 168 Hours
• Peak Reflow Compatible (260 C): Yes
• Leaded Process Compatible: Yes
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
VDD to GND
VIN to PGND
FB, COMP/EN to GND
DRVL to PGND
SW to PGND
BST to SW
BST to PGND
DRVH to SW
PGND to GND
θ
Operating Junction Temperature Range
Storage Temperature Range
Soldering Conditions
Maximum Soldering Lead Temperature
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all other voltages are
referenced to PGND.
JA
2-Layer Board
4-Layer Board
(10 sec)
(10-Lead MSOP)
−0.3 V to +28 V
−0.3 V to (VDD + 0.3 V)
−0.3 V to (VDD + 0.3 V)
Rating
−0.3 V to +6 V
−2.0 V to +28 V
−0.8 V to (VDD + 0.3 V)
−0.3 V to 28 V
−0.3 V to VDD
±0.3 V
213.1°C/W
171.7°C/W
−40°C to +125°C
−65°C to +150°C
JEDEC J-STD-020
300°C
Rev. 0 | Page 5 of 40
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type
θ
1
BOUNDARY CONDITION
In determining the values given in Table 2 and Table 3, natural
convection was used to transfer heat to a 4-layer evaluation board.
ESD CAUTION
θ
soldered in a circuit board for surface-mount packages.
JA
JA
JA
2-Layer Board
4-Layer Board
is specified for the worst-case conditions, that is, a device
(10-Lead MSOP)
is specified for the worst-case conditions; that is, θ
ADP1882/ADP1883
JA
θ
213.1
171.7
is specified for device
JA
1
°C/W
°C/W
Unit