LT3570IFE#TRPBF Linear Technology, LT3570IFE#TRPBF Datasheet - Page 19

• Manufacturer Part Number: LT3570IFE#TRPBF
• Description: IC PWM BUCK BST DIV CM 20TSSOP
• Manufacturer: Linear Technology

Specifications of LT3570IFE#TRPBF

• Topology: Step-Down (Buck) (1), Step-Up (Boost) (1), Linear (LDO) (1)
• Function: Automotive
• Number Of Outputs: 3
• Frequency - Switching: 500kHz ~ 2.1MHz
• Voltage/current - Output 1: Adj to 0.8V, 1.5A
• Voltage/current - Output 2: Adj to 0.8V, 1.5A
• Voltage/current - Output 3: Controller
• W/led Driver: No
• W/supervisor: No
• W/sequencer: No
• Voltage - Supply: 2.5 V ~ 36 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: *
• Package / Case: 20-TSSOP Exposed Pad, 20-eTSSOP, 20-HTSSOP
• Frequency-max: 2.75MHz
• Duty Cycle: 95%
• Pwm Type: Current Mode
• Buck: Yes
• Boost: Yes
• Flyback: No
• Inverting: No
• Doubler: No
• Divider: Yes
• Cuk: No
• Isolated: No
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

4.50 ± 0.05
PACKAGE DESCRIPTION
3.10 ± 0.05
2.45 ± 0.05
(4 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
6.60 ±0.10
(.0035 – .0079)
0.09 – 0.20
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
4.50 ±0.10
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
RECOMMENDED SOLDER PAD LAYOUT
0.50 BSC
0.25 ±0.05
(.169 – .177)
4.30 – 4.50*
0.70 ±0.05
(.020 – .030)
0.50 – 0.75
SEE NOTE 4
PACKAGE
OUTLINE
(.152)
MILLIMETERS
3.86
(INCHES)
0.65 BSC
24-Lead Plastic QFN (4mm × 4mm)
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGD-X)—TO BE APPROVED
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
20-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1697)
(Reference LTC DWG # 05-08-1663)
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT
ON THE TOP AND BOTTOM OF PACKAGE
0.45 ±0.05
Exposed Pad Variation CB
PIN 1
TOP MARK
(NOTE 6)
(.108)
0.25
REF
2.74
1.05 ±0.10
0° – 8°
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
4. RECOMMENDED MINIMUM PCB METAL SIZE
4.00 ± 0.10
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
(4 SIDES)
UF Package
FE Package
FOR EXPOSED PAD ATTACHMENT
(.0256)
0.65
BSC
20 1918 17 16 15
1
(.0077 – .0118)
0.195 – 0.30
2
0.75 ± 0.05
TYP
3 4 5 6 7 8 9 10
(.252 – .260)
6.40 – 6.60*
(.152)
3.86
2.45 ± 0.10
(4-SIDES)
14 13
0.200 REF
0.00 – 0.05
12
11
FE20 (CB) TSSOP 0204
(.002 – .006)
0.05 – 0.15
(.108)
(.047)
2.74
R = 0.115
1.20
MAX
BOTTOM VIEW—EXPOSED PAD
TYP
(.252)
6.40
BSC
23
24
0.50 BSC
0.25 ± 0.05
LT3570
1
2
(UF24) QFN 0105
0.40 ± 0.10
PIN 1 NOTCH
R = 0.20 TYP OR
0.35 × 45° CHAMFER
19
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