SG3842M Microsemi Analog Mixed Signal Group, SG3842M Datasheet - Page 2

• Manufacturer Part Number: SG3842M
• Description: IC PWM CURRENT MODE 8DIP
• Manufacturer: Microsemi Analog Mixed Signal Group

Specifications of SG3842M

• Pwm Type: Current Mode
• Number Of Outputs: 1
• Frequency - Max: 500kHz
• Duty Cycle: 100%
• Voltage - Supply: 8.2 V ~ 30 V
• Buck: No
• Boost: No
• Flyback: Yes
• Inverting: No
• Doubler: No
• Divider: No
• Cuk: No
• Isolated: Yes
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 8-DIP
• Frequency-max: 500kHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

SG1842/SG1843 Series
2
Supply Voltage (I
Supply Voltage (Low Impedance Source) ........................................................ 30V
Output Current (Peak) ....................................................................................... ±1A
Output Current (Continuous) ....................................................................... 350mA
Output Energy (Capacitive Load) ....................................................................... 5µJ
Analog Inputs (Pins 2, 3) ................................................................. -0.3V to +6.3V
Error Amp Output Sink Current ..................................................................... 10mA
Power Dissipation at T
Operating Junction Temperature
Storage Temperature Range .......................................................... -65°C to +150°C
Lead Temperature (Soldering, 10 Seconds) .................................................. 300°C
Pb-free / RoHS Peak Package Solder Reflow Temp. (40 second max. exposure)........ 260°C (+0, -5)
Note 1. Exceeding these ratings could cause damage to the device.
Note 2. All voltages are with respect to Pin 5. All currents are positive into the specified
M PACKAGE:
N PACKAGE:
DM PACKAGE:
D PACKAGE:
Y PACKAGE:
J PACKAGE:
F PACKAGE:
L PACKAGE:
Junction Temperature Calculation: T
The θ
system. All of the above assume no ambient airflow.
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θ θ θ θ θ
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θ θ θ θ θ
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θ θ θ θ θ
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θ θ θ θ θ
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θ θ θ θ θ
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θ θ θ θ θ
THERMAL RESISTANCE-JUNCTION TO CASE, θ θ θ θ θ
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θ θ θ θ θ
THERMAL RESISTANCE-JUNCTION TO CASE, θ θ θ θ θ
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θ θ θ θ θ
Hermetic (J, Y, F, L Packages) ................................................................... 150°C
Plastic (N, M, D, DM Packages) ................................................................ 150°C
JA
numbers are guidelines for the thermal performance of the device/pc-board
A B S O L U T E M A X I M U M R AT I N G S
terminal.
CC
< 30mA) ............................................................... Self Limiting
A
= 25°C (DIL-8) ............................................................ 1W
T H E R M A L D ATA
P R O D U C T D A T A B O O K 1 9 9 6 / 1 9 9 7
J
= T
C
A
U R R E N T
+ (P
P
R O D U C T I O N
D
JC
JC
x θ
JA
JA
JA
JA
JA
JA
JA
JA
JA
).
- M
O D E
(Notes 1 & 2)
P W M C
D
165°C/W
120°C/W
130°C/W
145°C/W
120°C/W
95°C/W
65°C/W
80°C/W
80°C/W
35°C/W
A T A
O N T R O L L E R
S
H E E T
1. COMP
2. V
3. I
4. R
5. POWER GND
4
5
6
7
8
SENSE
FB
T
/C
M Package: Pb-free / RoHS 100% Matte Tin Lead Finish
N Package: Pb-free / RoHS 100% Matte Tin Lead Finish
T
3
9
10
PACKAGE PIN OUTS
2
Pb-free / RoHS 100% Matte Tin Lead Finish
COMP
Pb-free / RoHS 100% Matte Tin Lead Finish
COMP
11
R
1 20 19
N.C.
N.C.
I
N.C.
R
T
COMP
SENSE
COMP
I
/C
SENSE
T
V
R
/C
R
V
12 13
I
N.C.
N.C.
I
N.C.
FB
SENSE
T
T
M & Y PACKAGE
SENSE
/C
T
FB
/C
V
V
J & N PACKAGE
T
DM PACKAGE
FB
FB
T
T
D PACKAGE
F PACKAGE
L PACKAGE
(Top View)
(Top View)
(Top View)
(Top View)
(Top View)
(Top View)
1
2
3
4
1
2
3
4
5
6
7
1
2
3
4
5
1
2
3
4
5
6
7
1
2
3
4
18
17
16
15
14
14
13
12
11
10
10
8
7
6
5
14
13
12
11
10
9
8
8
7
6
5
9
8
9
8
7
6
1. N.C.
2. COMP
3. N.C.
4. N.C.
5. V
6. N.C.
7. I
8. N.C.
9. N.C.
10. R
V
V
OUTPUT
GND
V
N.C.
V
V
OUTPUT
GROUND
POWER GND
REF
CC
V
V
OUTPUT
GND
SENSE
REF
CC
C
V
N.C.
V
V
OUTPUT
GND
PWR GND
FB
REF
CC
T
/C
REF
CC
C
T
Copyright © 2000
Rev. 1.6a 10/04
10.V
9. V
8. V
7. OUTPUT
6. GND
11. N.C.
12. GROUND
13. N.C.
14. N.C.
15. OUTPUT
16. N.C.
17. V
18. N.C.
19. N.C.
20. V
REF
CC
C
CC
REF