ADR445BRZ Analog Devices Inc, ADR445BRZ Datasheet - Page 8

• Manufacturer Part Number: ADR445BRZ
• Description: IC VREF LDO XFET 5.0V 8-SOIC
• Manufacturer: Analog Devices Inc
• Series: XFET®r

Specifications of ADR445BRZ

• Temperature Coefficient: 3ppm/°C
• Design Resources: 16-Bit Fully Isolated Output Module Using AD5422 and ADuM1401 (CN0065) 18-Bit Accurate, low noise, precision bipolar DC voltage source (CN0177)
• Reference Type: Series
• Voltage - Output: 5V
• Tolerance: ±0.04%
• Voltage - Input: 5.5 ~ 18 V
• Number Of Channels: 1
• Current - Quiescent: 3.75mA
• Current - Output: 10mA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Topology: Series
• Input Voltage: 5.5V To 18V
• Reference Voltage: 5V
• Reference Voltage Tolerance: 2mV
• Voltage Reference Case Style: SOIC
• No. Of Pins: 8
• Fixed / Adjust / Prog: Precision
• Output Voltage (max): 5V
• Reference Voltage Accuracy (max): 0.04
• Line Regulation: 20ppm/V
• Load Regulation: 50ppm/mA
• Input Voltage (max): 20V
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 8
• Package Type: SOIC N
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Cathode: -
• Lead Free Status / Rohs Status: Compliant

ADR440/ADR441/ADR443/ADR444/ADR445
ABSOLUTE MAXIMUM RATINGS
T
Table 7.
Parameter
Supply Voltage
Output Short-Circuit Duration to GND
Storage Temperature Range
Operating Temperature Range
Junction Temperature Range
Lead Temperature, Soldering (60 sec)
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
A
= 25°C, unless otherwise noted.
Rating
20 V
Indefinite
−65°C to +125°C
−40°C to +125°C
−65°C to +150°C
300°C
Rev. E | Page 8 of 20
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 8. Thermal Resistance
Package Type
8-Lead SOIC (R-Suffix)
8-Lead MSOP (RM-Suffix)
ESD CAUTION
JA
is specified for the worst-case conditions, that is, a device
θ
130
132.5
JA
θ
43
43.9
JC
Unit
°C/W
°C/W