ADM1023ARQ ON Semiconductor, ADM1023ARQ Datasheet - Page 16
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ADM1023ARQ
Manufacturer Part Number
ADM1023ARQ
Description
IC SENSOR TEMP PREC DUAL 16QSOP
Manufacturer
ON Semiconductor
Datasheet
1.ADM1023ARQZ.pdf
(16 pages)
Specifications of ADM1023ARQ
Rohs Status
RoHS non-compliant
Function
Temp Monitoring System (Sensor)
Topology
ADC, Comparator, Multiplexer, Register Bank
Sensor Type
External & Internal
Sensing Temperature
0°C ~ 120°C, External Sensor
Output Type
SMBus™
Output Alarm
Yes
Output Fan
No
Voltage - Supply
3 V ~ 5.5 V
Operating Temperature
0°C ~ 120°C
Mounting Type
Surface Mount
Package / Case
16-QSOP
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ADM1023ARQ-REEL
Manufacturer:
HITACHI
Quantity:
57
Part Number:
ADM1023ARQ-REEL
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Company:
Part Number:
ADM1023ARQZ
Manufacturer:
ADI
Quantity:
12 255
Company:
Part Number:
ADM1023ARQZ-REEL
Manufacturer:
IDT
Quantity:
56
Part Number:
ADM1023ARQZ-REEL
Manufacturer:
ADI/亚德诺
Quantity:
20 000
PUBLICATION ORDERING INFORMATION
Protected by U.S. Patents 5,195,827; 5,867,012; 5,982,221; 6,097,239; 6,133,753; 6,169,442; other patents pending.
Pentium is a registered trademark of Intel Corporation.
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor and
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
L
−B−
0.25 (0.010)
C
D
0.25 (0.010)
16 PL
M
T
−A−
M
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
G
T B
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A
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SEATING
PLANE
−T−
0.013 X 0.005
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
0.005−0.010
USA/Canada
Phone: 421 33 790 2910
Phone: 81−3−5773−3850
Q
DP. MAX
H x 45_
M
RAD.
RAD.
DETAIL E
TYP
http://onsemi.com
J
CASE 492−01
ADM1023
V
QSOP16
ISSUE O
16
F
DETAIL E
MOLD PIN
MARK
N
8 PL
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. THE BOTTOM PACKAGE SHALL BE BIGGER THAN
4. PLASTIC DIMENSIONS DOES NOT INCLUDE MOLD
5. BOTTOM EJECTOR PIN WILL INCLUDE THE
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
Y14.5M, 1982.
THE TOP PACKAGE BY 4 MILS (NOTE: LEAD SIDE
ONLY). BOTTOM PACKAGE DIMENSION SHALL
FOLLOW THE DIMENSION STATED IN THIS
DRAWING.
FLASH OR PROTRUSIONS. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 6 MILS PER
SIDE.
COUNTRY OF ORIGIN (COO) AND MOLD CAVITY I.D.
DIM
A
B
C
D
G
H
K
M
N
P
Q
R
U
V
F
J
L
0.0098
0.189
0.150
0.061
0.008
0.016
0.008
0.004
0.230
0.007
0.025
0.025
MIN
0.025 BSC
0.020 DIA
0
0
0
INCHES
_
_
_
0.0075
MAX
0.196
0.157
0.068
0.012
0.035
0.018
0.010
0.244
0.035
0.035
0.011
8
7
8
_
_
_
0.249
MILLIMETERS
MIN
4.80
3.81
1.55
0.20
0.41
0.20
0.10
5.84
0.18
0.64
0.64
0.64 BSC
0
0
0
0.51 DIA
_
_
_
ADM1023/D
0.191
MAX
4.98
3.99
1.73
0.31
0.89
0.46
0.25
6.20
0.28
0.89
0.89
8
7
8
_
_
_