MAX6632MTT+T Maxim Integrated Products, MAX6632MTT+T Datasheet - Page 7

• Manufacturer Part Number: MAX6632MTT+T
• Description: IC TEMP SENSOR DGTL 6-TDFN
• Manufacturer: Maxim Integrated Products

Specifications of MAX6632MTT+T

• Function: Temp Monitoring System (Sensor)
• Topology: ADC (Sigma Delta)
• Sensor Type: Internal
• Sensing Temperature: -55°C ~ 150°C
• Output Type: SPI™
• Output Alarm: No
• Output Fan: No
• Voltage - Supply: 3 V ~ 5.5 V
• Operating Temperature: -55°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 6-TDFN Exposed Pad
• Full Temp Accuracy: +/- 0.2 C
• Digital Output - Bus Interface: Serial (3-Wire, SPI)
• Digital Output - Number Of Bits: 12 bit + Sign
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 55 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

The key to accurate temperature monitoring is good
thermal contact between the MAX6629–MAX6632 pack-
age and the object being monitored. In some applica-
tions, the 6-pin SOT23 package is small enough to fit
underneath a socketed µP, allowing the device to moni-
tor the µP’s temperature directly. Accurate temperature
monitoring depends on the thermal resistance between
the object being monitored and the MAX6629–MAX6632
die. Heat flows in and out of plastic packages primarily
through the leads. If the sensor is intended to measure
the temperature of a heat-generating component on the
circuit board, it should be mounted as close as possible
to that component and should share supply and ground
traces (if they are not noisy) with that component where
possible. This maximizes the heat transfer from the com-
ponent to the sensor.
The MAX6629/MAX6630 supply current is typically
200µA, and the MAX6631/MAX6632 supply current is
typically 32µA. When used to drive high-impedance
loads, the device dissipates negligible power.
Therefore, the die temperature is essentially the same
as the package temperature.
The rise in die temperature due to self-heating is given
by the following formula:
where P
MAX6629–MAX6632, and θ
resistance.
The typical thermal resistance is +110°C/W for the
6-pin SOT23 package. To limit the effects of self-heat-
ing, minimize the output currents. For example, if the
MAX6629–MAX6632 sink 1mA, the output voltage is
guaranteed to be less than 0.4V. Therefore, an addi-
tional 0.4mW of power is dissipated within the IC. This
corresponds to a 0.044°C shift in the die temperature in
the 6-pin SOT23.
DISSIPATION
12-Bit + Sign Digital Temperature Sensors
ΔT
Applications Information
J
_______________________________________________________________________________________
= P
is the power dissipated by the
DISSIPATION
Thermal Considerations
JA
is the package’s thermal
x θ
JA
PROCESS: BiCMOS
For the latest package outline information and land patterns,
go to www.maxim-ic.com/packages. Note that a “+”, “#”, or
“-” in the package code indicates RoHS status only. Package
drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
PACKAGE TYPE
6 TDFN-EP
6 SOT23
with Serial Interface
TEMPERATURE
MAX6629
MAX6630
MAX6631
MAX6632
SENSOR
PACKAGE CODE
Package Information
SPI-COMPATIBLE
12-BIT + SIGN
Functional Diagram
∑Δ ADC
U6FH-6
T633+2
INTERFACE
Chip Information
REFERENCE
VOLTAGE
DOCUMENT NO.
21-0058
21-0137
CS
SCK
SO
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