MAX6613MXK+T Maxim Integrated Products, MAX6613MXK+T Datasheet - Page 5

IC TEMP SENSOR ANLG SC70-5

MAX6613MXK+T

Manufacturer Part Number
MAX6613MXK+T
Description
IC TEMP SENSOR ANLG SC70-5
Manufacturer
Maxim Integrated Products
Datasheet

Specifications of MAX6613MXK+T

Sensing Temperature
-55°C ~ 130°C
Output Type
Voltage
Voltage - Supply
1.8 V ~ 5.5 V
Accuracy
±4°C
Package / Case
SC-70-5, SC-88A, SOT-323-5, SOT-353, 5-TSSOP
Mounting Type
*
Operating Temperature
*
Function
*
Sensor Type
*
Topology
*
Output Fan
*
Output Alarm
*
Full Temp Accuracy
+/- 5 C
Gain
- 11.23 mV / C
Maximum Operating Temperature
+ 130 C
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MAX6613MXK+T
MAX6613MXK+TTR
A temperature sensor IC like the MAX6613 that senses
its own die temperature must be mounted on, or close
to, the object whose temperature it is intended to mea-
sure. Because there is a good thermal path between
the package’s metal lead and the IC die, the MAX6613
can accurately measure the temperature of the circuit
board to which it is soldered. If the sensor is intended
to measure the temperature of a heat-generating com-
ponent on the circuit board, it should be mounted as
close as possible to that component and should share
supply and ground traces (if they are not noisy) with
that component where possible. This optimizes the
thermal connection from the component to the sensor.
The thermal path between the plastic package and the
die is not as good as the path through the lead, so the
MAX6613, like all temperature sensors in plastic pack-
ages, is less sensitive to the temperature of the sur-
rounding air than to the temperature of its leads. It can
be successfully used to sense ambient temperature if
the circuit board is designed to track the ambient tem-
perature.
Applications Information
_______________________________________________________________________________________
Sensing Circuit Board and
Ambient Temperature
Low-Voltage Analog Temperature
Sensor in an SC70 Package
As with any IC, the wiring and circuits must be kept
insulated and dry to avoid leakage and corrosion,
especially if the part is operated at cold temperatures
where condensation can occur.
The change in die temperature introduced by the part
due to self-heating is negligible.
PROCESS: BiCMOS
For the latest package outline information and land patterns,
go to www.maxim-ic.com/packages. Note that a “+”, “#”, or
“-” in the package code indicates RoHS status only. Package
drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
PACKAGE
5 SC70
TYPE
PACKAGE
CODE
X5+1
Package Information
Chip Information
OUTLINE
21-0076
NO.
PATTERN NO.
90-0188
LAND
5

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